| Allicdata Part #: | ATS2672-ND |
| Manufacturer Part#: |
ATS-01A-12-C2-R0 |
| Price: | $ 4.16 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X12.7MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01A-12-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.78000 |
| 10 +: | $ 3.67794 |
| 25 +: | $ 3.47382 |
| 50 +: | $ 3.26957 |
| 100 +: | $ 3.06520 |
| 250 +: | $ 2.86086 |
| 500 +: | $ 2.65651 |
| 1000 +: | $ 2.60542 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.86°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management solutions, such as the ATS-01A-12-C2-R0, offer efficient thermal and heat dissipation solutions to device manufacturers. This Thermal - Heat Sink is designed to disperse heat away from sensitive electronic components or devices. By dissipating heat, the air around the device is prevented from exceeding predetermined temperature limits.
The ATS-01A-12-C2-R0 is a two-piece ABS plastic heat sink with long-lasting aluminum fins, designed specifically for applications such as circuit boards and consoles. The heat sink features a peak temperature rating of 200°C and a maximum thermal dissipation power of 10 W. With a base thickness of 6.55 mm, the heat sinks work very efficiently without decreasing the device’s performance. This allows for higher performance and heat dissipation without increasing the overall device size.
The ATS-01A-12-C2-R0 has a heat dissipation capacity of 5 mm²/W with an external airflow of 0.5 m/s. This allows for efficient heat removal and cooling of devices during peak operation. Additionally, the heat sink features a special channel that directs air towards the heat dissipation fins, further increasing its efficiency. This designed feature is called “Cross Fin Technology”, which promotes the transfer of concentrated heat away from the device. This is a great feature when it comes to space management. This technology does not require additional space for an additional fan.
The ATS-01A-12-C2-R0 offers excellent temperature management for electronic components and consoles. At lower temperatures, these heat sinks have a better lifetime and can reduce the risk of component failure. With a conventional fan, these temperatures may take longer to reach, but the temperature regulation with the ATS-01A-12-C2-R0 is consistent and fast. This allows for quick reactions to heat buildup in real-time.
In conclusion, the ATS-01A-12-C2-R0 is an efficient thermal management solution designed to dissipate heat away from sensitive electronics. The lightweight ABS plastic base allows the heat sink to be installed easily and quickly. This durable design and robust construction ensures the best temperature control during peak periods. The Cross Fin Technology also optimizes airflow and heat dissipation by transferring heat away from the device. This two-piece heat sink is perfect for circuit boards, consoles, and any other electronic components that require effective heat dissipation.
The specific data is subject to PDF, and the above content is for reference