ATS-01A-136-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-01A-136-C1-R0-ND

Manufacturer Part#:

ATS-01A-136-C1-R0

Price: $ 6.36
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 70X70X25MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-01A-136-C1-R0 datasheetATS-01A-136-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 5.72544
30 +: $ 5.40750
50 +: $ 5.08939
100 +: $ 4.77131
250 +: $ 4.45322
500 +: $ 4.13513
1000 +: $ 4.05561
Stock 1000Can Ship Immediately
$ 6.36
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.756" (70.00mm)
Width: 2.756" (70.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 2.17°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Heat sinks are a common form of cooling system used to help maintain the temperature of various components. They are most commonly used to dissipate heat from electronics and are widely used in industries ranging from aerospace and military to consumer and medical. ATS-01A-136-C1-R0 thermal heat sinks provide a highly efficient means of cooling electrical components while also providing a light weight alternative to other cooling solutions.The ATS-01A-136-C1-R0 thermal heat sink is designed to dissipate the heat coming from an electronic component, such as chips, into the atmosphere. It is a quad finned extruded aluminum blower-type design with a chrome-plated steel base. The design features a thermal efficiency of up to 85%, making it one of the most efficient heat sink solutions available today. Additionally, it is lightweight and easy to install, making it ideal for a wide range of applications.The main components of the ATS-01A-136-C1-R0 thermal heat sink are the fins, base plate, and exhaust fan. The fins are made of extruded aluminum which is designed to increase the surface area exposed to the air and maximize the cooling efficiency. The base plate is made of chrome-plated steel, which provides a secure mounting surface for the heat sink. The exhaust fan is an axial fan, which forces the heated air out of the heat sink.The ATS-01A-136-C1-R0 thermal-heat sink is designed to be used in a variety of applications, including automotive, consumer electronics, HVAC, military and medical. When used in automotive applications, it can help maintain engine component temperatures, providing horsepower and fuel economy improvements. In consumer electronics, it is ideal for cooling CPUs, FPGAs, and GPUs, allowing electronic components to run cooler and more efficiently. Additionally, it is well suited for cooling high-power laser diodes, which require an efficient cooling solution. For medical applications, the heat sink can be used to control temperatures in certain imaging devices, such as MRI machines.

In addition to providing a high level of thermal efficiency, the ATS-01A-136-C1-R0 thermal heat sink also offers improved noise reduction. As a blower-type design, it produces minimal noise and is significantly quieter than conventional cooling solutions. Additionally, it has the ability to maintain its temperature with minimal power consumption, improving energy efficiency and lowering costs.The ATS-01A-136-C1-R0 thermal heat sink is easy to install and can generally be completed in a few minutes. The heat sink simply needs to be affixed to the component that requires cooling and then connected to the power supply. Once connected, the fan will automatically initiate cooling and will continue to cool as long as it is needed. The fan can also be configured with a temperature sensor, allowing the heat sink to adjust its cooling levels based on the component temperature.

Overall, the ATS-01A-136-C1-R0 thermal heat sink is an extremely efficient and reliable cooling solution for a variety of applications. It can be used to efficiently cool high-power components, such as CPUs, FPGAs, and GPUs. Additionally, it is well suited for cooling medical and automotive components, improving performance and reducing heat-related failures. In addition to its high thermal efficiency, the heat sink also offers improved noise reduction and minimal power consumption, making it a cost-effective and energy efficient option for a variety of applications.

The specific data is subject to PDF, and the above content is for reference

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