ATS-01A-15-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.969" (50.00mm)
Width:	1.969" (50.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	7.44°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal – Heat Sinks

Heat sinks are special components used to absorb the heat generated by electrical and electronic circuits. They can be used to reduce the operating temperature of a device and protect the device from overheating. The ATS-01A-15-C2-R0 is a type of heat sink commonly used in automotive, industrial, and military applications. In this article, we will look at the application field and working principle of ATS-01A-15-C2-R0.

The ATS-01A-15-C2-R0 was designed with a wide range of applications in mind. It features a sealed construction that protects it from dust, dirt, and humidity. It can be used in automotive, industrial, and military applications, where vibration or shock may cause other heat sinks to fail. It is also suitable for use in high-temperature environments, as it can withstand temperatures up to 150℃.

The ATS-01A-15-C2-R0 is made up of a base and a heat dissipation fin. The base is usually made of aluminum or copper, and the fins are usually made of aluminum or steel. The base and the fins are connected together with screws, bolts, or rivets. The base absorbs the heat from the device and transfers it to the fins. The fins then dissipate the heat into the surrounding air. The number of fins and their shape are chosen to optimize the heat dissipation efficiency.

The ATS-01A-15-C2-R0 is designed to be installed onto circuit boards. The heat sink is attached to the circuit board with screws, bolts, or rivets, and it can also be bonded to the board with a thermal compound. The thermal compound fills in any gaps between the heat sink and the board, and helps to increase the efficiency of the heat transfer. The thermal compound also protects the board from any potential damage due to vibration or shock.

The ATS-01A-15-C2-R0 can also be used with cooling fans. The fans help to further increase the efficiency of the heat dissipation. The fans are usually installed on the side of the heat sink and are powered by the same power supply as the device. The fans create an airstream that helps to further dissipate the heat generated by the device.

The ATS-01A-15-C2-R0 is a reliable and efficient way of cooling electronic components. It is relatively inexpensive, easy to install, and is suitable for a wide range of applications. The sealed design ensures that it is protected from dust and dirt, and its low profile allows it to be installed in tight spaces. The ATS-01A-15-C2-R0 is a great choice for anyone looking for an effective way to reduce the operating temperature of a device.

The specific data is subject to PDF, and the above content is for reference