ATS-01A-156-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-01A-156-C3-R0-ND

Manufacturer Part#:

ATS-01A-156-C3-R0

Price: $ 4.24
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X25MM L-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-01A-156-C3-R0 datasheetATS-01A-156-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.81717
30 +: $ 3.60507
50 +: $ 3.39293
100 +: $ 3.18087
250 +: $ 2.96881
500 +: $ 2.75675
1000 +: $ 2.70374
Stock 1000Can Ship Immediately
$ 4.24
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 4.24°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Heat sinks are essential components used in many applications to help dissipate heat generated by the electronic components of a system or drive. Thermal-heat sinks, such as the ATS-01A-156-C3-R0, operate in a manner that is similar to a traditional heat sink, but with enhanced performance. In this article, explore the application field and working principles of the ATS-01A-156-C3-R0.

ATS-01A-156-C3-R0 thermal-heat sinks are designed for use in applications that require increased temperature control and/or a more efficient cooling system. These heat sinks are designed to run at an optimum temperature range in order to maintain a balance between the thermal needs of the components and the climate or air temperature around it. This allows the system to remain stable regardless of outside temperature changes. The ATS-01A-156-C3-R0 also operates at a lower power level than traditional heat sinks, making it more energy efficient. Additionally, the ATS-01A-156-C3-R0 is designed to dissipate heat more evenly and quickly, making it suitable for use in applications where high heat loads or sudden temperature spikes pose a challenge.

The ATS-01A-156-C3-R0 thermal-heat sink works by providing an increase in surface area, in comparison to traditional heat sinks. This increased surface area allows the heat generated by the electronic components to dissipate more quickly, allowing the system to stay cooler. Additionally, the thermal-heat sink is designed to provide improved airflow to the components, as well as to redirect the hottest air away from them.

The ATS-01A-156-C3-R0 thermal-heat sink is suitable for use in a variety of applications, such as those that require increased cooling efficiency like high power amplifiers, power supplies, and server racks. Additionally, the ATS-01A-156-C3-R0 is ideal for applications where heat-sensitive components need to remain within a specific temperature range, in order for them to function properly. This includes applications such as 3D printers, process control systems, medical equipment, and industrial robotics.

Furthermore, the ATS-01A-156-C3-R0 is designed to be easy to install and use, and it is compatible with a number of mounting systems to ensure it can fit into any system. The ATS-01A-156-C3-R0 is available in various sizes and configurations, and it is made of a durable aluminum alloy, making it ideal for long-term use.

In summary, the ATS-01A-156-C3-R0 thermal-heat sink is designed for use in applications that require increased temperature control and/or a more efficient cooling system. It offers increased surface area and improved airflow, as well as the ability to dissipate heat quickly and evenly. The ATS-01A-156-C3-R0 is ideal for high power amplifiers, power supplies, server racks, medical equipment, and industrial robotics, and is available in various sizes and configurations.

The specific data is subject to PDF, and the above content is for reference

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