ATS-01A-16-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-01A-16-C3-R0-ND

Manufacturer Part#:

ATS-01A-16-C3-R0

Price: $ 4.11
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 54X54X10MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-01A-16-C3-R0 datasheetATS-01A-16-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.73590
30 +: $ 3.52842
50 +: $ 3.32098
100 +: $ 3.11340
250 +: $ 2.90584
500 +: $ 2.69828
1000 +: $ 2.64639
Stock 1000Can Ship Immediately
$ 4.11
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.126" (54.01mm)
Width: 2.126" (54.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 18.14°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks have a variety of applications in a range of industries and are used for a variety of purposes. The ATS-01A-16-C3-R0 is a type of heat sink specifically designed to meet the needs of high performance applications. This type of heat sink combines exceptional thermal performance and efficient heat dissipation in a miniature package.

The ATS-01A-16-C3-R0 features a base constructed of aluminum alloy, which is an excellent thermal conductor. The sink is able to dissipate heat quickly and is designed to provide an extremely effective thermal solution for applications requiring maximum thermal performance. It is also designed to work with a variety of materials, including copper, stainless steel, and aluminum.

The ATS-01A-16-C3-R0 is equipped with two rows of high quality copper heat spreaders. These heat spreaders are designed to provide maximum thermal performance and efficient heat dissipation. The heat spreaders are also adjustable, allowing for further customization of thermal performance. The heat spreader design provides superior air flow characteristics, allowing for optimal cooling.

The ATS-01A-16-C3-R0 is designed with a combination of natural convection cooling and forced convection cooling. The natural convection cooling utilizes the natural flow of air due to temperature differences to aid with cooling. The use of a fan is used to increase the convection cooling rate, allowing for even more efficient heat dissipation and optimum thermal performance.

The ATS-01A-16-C3-R0 is designed to be a versatile heat sink, providing a number of advantages to its users. The design is optimized for high performance applications, allowing for extreme thermal performance and efficient heat dissipation. It is also designed to be easy to install and highly customizable, allowing for a variety of applications.

The ATS-01A-16-C3-R0 is a great choice for a variety of applications requiring maximum thermal performance and efficient heat dissipation. It features superior air flow characteristics, excellent thermal conductivity, and a customizable design that is easy to install. With its combination of natural convection cooling and forced convection cooling, it is an ideal choice for high performance applications. Whether you need to dissipate heat from a processor, GPU, memory device, or other electronic components, the ATS-01A-16-C3-R0 is the perfect thermal solution.

The specific data is subject to PDF, and the above content is for reference

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