ATS-01A-18-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.126" (54.01mm)
Width:	2.126" (54.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.590" (15.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	13.45°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

Thermal-Heat sinks are used to dissipate the heat generated by electronics, and ATS-01A-18-C3-R0 is one of the most commonly used varieties. This product is designed to provide optimal performance in various applications. The main purpose of this product is to reduce the thermal stress on electronic components, and the high performance ensures that it is suitable for any application. In this article, we will discuss the application field and working principles of ATS-01A-18-C3-R0.

Application Field

ATS-01A-18-C3-R0 is widely used in many different applications, such as in automotive electronics, aerospace applications, telecommunications, power supplies, medical devices, laser systems, and other applications. It is suitable for a wide range of environments, and the components are engineered for maximum efficiency. The product has a very low power consumption and is optimized for high-efficiency thermal dissipation. It can provide high-reliability performance over a wide temperature range.

Working Principle

ATS-01A-18-C3-R0 is designed to use heat dissipation technology to draw heat away from electronic components. It uses a low-temperature, forced-air cooling system which is quieter than most air-cooled heatsinks. It also eliminates the need for fans or other active cooling devices, making it ideal for applications with restricted space and restricted noise levels. The product is designed to dissipate heat evenly along all sides of the cooling surface, ensuring uniform cooling performance. The product is also designed to ensure that the electronic components remain at a safe temperature and are not damaged by excessive heat. The cooling system ensures that the thermal radiation is balanced and evenly distributed, ensuring high performance and maximum efficiency.

Conclusion

In conclusion, ATS-01A-18-C3-R0 is a thermal-heat sink that is widely used in many different applications. It is designed to provide optimal performance in a variety of environments and for a wide range of applications. The product is designed to provide high-reliability performance over a wide temperature range and has a very low power consumption. The product uses low-temperature, forced-air cooling technology to dissipate heat evenly across the cooling surface. This ensures uniform cooling performance and maximum efficiency.

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