ATS-01A-200-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.969" (50.00mm)
Width:	1.969" (50.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	9.76°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction
The ATS-01A-200-C1-R0 is a thermal heat sink designed by Advanced Thermal Solutions Inc., which is based in Massachusetts, USA. The ATS-01A-200-C1-R0 provides effective thermal management of high-power heat-producing components such as processors, CPUs, chipsets, and other circuit components. This device is available in a range of sizes, thus providing the user with the flexibility to choose the size that best fits into their application. In addition, the ATS-01A-200-C1-R0 is also designed for easy installation, requiring only a few components for assembly.Application Field
The ATS-01A-200-C1-R0 is ideal for applications that require high thermal efficiency, such as server and gaming systems, telecom equipment, medical equipment and lab equipment. It is also suitable for applications that require high-density solutions, such as servers, high-power workstations, machine tools, control systems, and data centers.Working Principle
The ATS-01A-200-C1-R0 works on the principle of convection cooling. This is a form of cooling where a flow of air or gas is used to transfer heat away from the component being cooled. The ATS-01A-200-C1-R0 uses an efficient two-stage cooling methodology. The first stage of cooling involves the use of a thermally conductive metal plate which takes up heat from the components being cooled. The plate then radially disperses this heat to the aluminum fins which are attached to its back. The fins provide a larger surface area which helps in the rapid dissipation of the heat away from the components.The second stage of cooling utilizes a fan, which draws outside air over the heat sink and further dissipates the heat away from the components. This combination of convection and fan cooling helps to keep the components at a steady temperature and ensures optimal performance.Structure
The ATS-01A-200-C1-R0 is composed of a metal plate which is coupled with four dissimilar composite aluminum fins. The metal plate is thermally conductive and designed to evenly spread heat over a larger area. The aluminum fins feature a unique perforation pattern which maximizes their surface area and ensures optimal heat dissipation. This combination provides high levels of thermal efficiency while ensuring minimal thermal resistance.The ATS-01A-200-C1-R0 also comes with an integrated fan that directs outside air over the fins. The fan is controllable and thus can be adjusted depending on the severity of the heat dissipation demand. This allows the user to adjust the temperature of the components accordingly without compromising on performance.Conclusion
The ATS-01A-200-C1-R0 is an effective thermal heat sink that can provide efficient cooling of high-power heat-producing components such as processors, CPUs, chipsets, and other circuit components. This device works on the principle of convection cooling and utilizes an efficient two-stage cooling methodology. The combination of the metal plate and the aluminum fins allows for high levels of thermal efficiency while ensuring minimal thermal resistance, and the integrated fan allows for further customization of the temperature for optimal performance.

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