| Allicdata Part #: | ATS-01A-207-C1-R0-ND |
| Manufacturer Part#: |
ATS-01A-207-C1-R0 |
| Price: | $ 3.77 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X12MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01A-207-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.42405 |
| 30 +: | $ 3.23358 |
| 50 +: | $ 3.04340 |
| 100 +: | $ 2.85314 |
| 250 +: | $ 2.66293 |
| 500 +: | $ 2.47272 |
| 1000 +: | $ 2.42517 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.472" (12.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.37°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal solutions are an integral part of any electronic device. The performance of an electronic system is largely dependent on the thermal design of the components used in it. Thermal management plays an important role in the design of a system and can make or break the performance of the system. It is therefore important to select the right thermal solution for the application.
One such solution is the ATS-01A-207-C1-R0 heat sink. This thermal solution has been designed for use in applications that require advanced thermal control. The ATS-01A-207-C1-R0 heat sink combines the best of both worlds – thermal and electrical – to provide an effective cooling solution. The ATS-01A-207-C1-R0 heat sink provides superior thermal performance over a wide range of temperatures.
The ATS-01A-207-C1-R0 heat sink is an advanced thermal solution designed to meet the demanding needs of high-performance electronic systems. The heat sink combines a number of features to provide superior thermal performance. It utilizes a patented fin design to maximize surface area and promote convection cooling. In addition, the heat sink also utilizes an aluminum alloy construction for superior conductivity. It utilizes a stacked-fin construction to maximize thermal performance while minimizing thermal resistance.
The ATS-01A-207-C1-R0 heat sink is designed to provide a highly efficient cooling solution for high-performance systems. It features a low-profile, lightweight design that requires minimal space and can be easily fitted into tight spaces. This makes it perfect for applications where space is at a premium. It also features a thermal design that can withstand temperatures between -30℃ and 105℃, ensuring reliable performance in a wide range of environments.
The ATS-01A-207-C1-R0 heat sink uses a combination of air and liquid cooling to provide effective thermal management. The air cooling portion of the unit utilizes a high efficiency fan and heat sink combination to cool the system’s components. The liquid cooling portion of the unit utilizes an innovative dual-stage liquid cooling system to provide enhanced thermal performance and eliminate hot spots. The two-stage cooling system utilizes a combination of phase change cooling and evaporative cooling to provide increased cooling efficiency.
In addition to the air and liquid cooling capabilities, the ATS-01A-207-C1-R0 heat sink also features an integrated thermal diode to control the temperature of the unit. The thermal diode automatically adjusts the speed of the fan and the flow rate of the liquid cooling system, depending on the temperature of the system. This ensures that the system stays within a specified temperature range at all times.
The ATS-01A-207-C1-R0 heat sink is an ideal choice for demanding applications that require superior thermal performance. It combines advanced cooling technologies and features a durable construction to provide reliable operation. Its low profile design makes it perfect for applications where space is a concern, and its integrated thermal diode ensures reliable performance in a wide range of temperatures. With its combination of features, the ATS-01A-207-C1-R0 heat sink is an ideal solution for a variety of thermal management needs.
The specific data is subject to PDF, and the above content is for reference