| Allicdata Part #: | ATS-01A-23-C1-R0-ND |
| Manufacturer Part#: |
ATS-01A-23-C1-R0 |
| Price: | $ 4.24 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X15MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01A-23-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.81717 |
| 30 +: | $ 3.60507 |
| 50 +: | $ 3.39293 |
| 100 +: | $ 3.18087 |
| 250 +: | $ 2.96881 |
| 500 +: | $ 2.75675 |
| 1000 +: | $ 2.70374 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 11.99°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are devices used to transfers heat generated by electronic components to the surrounding air and prevent the overheating of those components. ATS-01A-23-C1-R0 is a type of heat sink, designed for applications in power electronic components and hybrid components with high current and power losses.
The ATS-01A-23-C1-R0 has an anodized finish which provides superior electrical insulation and corrosion resistance. The sink also features an integrated thermal pad to ensure good heat transfer between the component and the sink. The fins are angled in a way to maximize exposure to airflow, aiding in heat dissipation. The heat sink also has an insulated base which ensures that the heat generated by the component is not dissipated directly into the circuit board.
The ATS-01A-23-C1-R0 is designed to accommodate a range of power electronic components, including power MOSFETs, IGBTs, synchronous rectifiers, diodes, and bridge rectifiers. It is also suitable for electronic devices with high power dissipation, such as solid-state relays, drivers, and switches. The anodized finish provides improved performance, while the integrated thermal pad ensures good heat transfer between the component and the sink.
When using the ATS-01A-23-C1-R0, it is important to ensure that the thermal pad is properly installed. This will ensure good thermal contact between the component and the sink, allowing the heat to be properly dissipated. Additionally, it is important to ensure adequate airflow around the sink, as this will help to further improve the performance of the sink.
In terms of its working principle, the basic concept behind heat sinks is to dissipate the heat generated by electronic components to the surrounding air. This is done by using materials with high thermal conductivity, such as metal and aluminum, which absorb the heat and transfer it away from the components. The heat is then dissipated by a combination of conduction, convection, and radiation to the surrounding environment.
In conclusion, the ATS-01A-23-C1-R0 is a type of heat sink designed for applications in power electronic components and hybrid components with high current and power losses. It features an anodized finish for superior electrical insulation and corrosion resistance, and an integrated thermal pad to ensure good heat transfer between the component and the sink. Additionally, it is important to ensure proper installation of the thermal pad, as well as adequate airflow, in order to ensure optimal performance of the sink. By following these steps, you can ensure that your components are kept at appropriate temperatures and protected from overheating.
The specific data is subject to PDF, and the above content is for reference