| Allicdata Part #: | ATS-01A-30-C3-R0-ND |
| Manufacturer Part#: |
ATS-01A-30-C3-R0 |
| Price: | $ 8.13 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01A-30-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 7.31934 |
| 30 +: | $ 6.88861 |
| 50 +: | $ 6.45813 |
| 100 +: | $ 6.02759 |
| 250 +: | $ 5.59705 |
| 500 +: | $ 5.48941 |
| 1000 +: | $ 5.38177 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.35°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management and heat dissipation are essential for any system and various components to function reliably and efficiently. One of the most common devices used to dissipate heat is the heat sink, which utilizes its larger surface area to absorb and dissipate thermal energy from its surroundings. The ATS-01A-30-C3-R0 is a heat sink manufactured by Aavid Thermalloy that is designed for high-powered applications and is capable of dissipating up to 30 watts of power.
The ATS-01A-30-C3-R0 heat sink is an aluminum-extruded design with a large fin array for increased surface area to dissipate heat. The large fin array maximizes the overall surface area of the heat sink, allowing for a larger thermal mass that can be dissipated. The aluminum extrusion also helps to lower the cost of manufacturing while still providing superior thermal performance. The heat sink is designed to be mounted onto a circuit board and has an integrated fan-out feature which allows for an improved air-flow and better cooling performance.
The ATS-01A-30-C3-R0 heat sink is designed for applications with high-powered components such as microprocessors, CPUs, and GPUs. The large fin array provides a much larger surface area than a typical heat sink and allows for a much more efficient transfer of thermal energy from the components to the external environment. The large surface area also allows for a higher thermal conductivity and the integrated fan-out feature helps to maximize the air-flow around the components.
The ATS-01A-30-C3-R0 heat sink is an excellent choice for applications that have high-powered components such as CPUs and GPUs. The large surface area makes the heat sink capable of dissipating up to 30 watts of power while still maintaining a low-cost manufacturing cost. The integrated fan-out feature provides an improved air-flow, maximizing the thermal performance of the heat sink. The ATS-01A-30-C3-R0 is an excellent choice for applications that need an efficient and reliable heat sink for efficient thermal energy dissipation.
The specific data is subject to PDF, and the above content is for reference