| Allicdata Part #: | ATS-01A-32-C2-R0-ND |
| Manufacturer Part#: |
ATS-01A-32-C2-R0 |
| Price: | $ 5.81 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 57.9X36.83X11.43MM T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01A-32-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.22837 |
| 30 +: | $ 4.93773 |
| 50 +: | $ 4.64726 |
| 100 +: | $ 4.35683 |
| 250 +: | $ 4.06637 |
| 500 +: | $ 3.77592 |
| 1000 +: | $ 3.70330 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.280" (57.90mm) |
| Width: | 1.450" (36.83mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.450" (11.43mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 21.46°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important part of any modern electronic system and heat sinks are the most common solution. A heat sink is a metal object specifically designed to absorb and dissipate heat from an electronic component or system. The ATS-01A-32-C2-R0 heat sink is a high-performance, cost-effective solution for thermal management in a variety of applications.
The ATS-01A-32-C2-R0 heat sink is designed to extract the heat generated from devices such as processors, high-powered LEDs, and power converters. The profile of the heat sink incorporates two different fins: one with large fin openings for maximum air flow and heat dissipation, and the other with small fin openings, which provide better conduction for maximum thermal transfer. This gives the user the ability to optimize the performance/cost ratio.
The ATS-01A-32-C2-R0 heat sink consists of a combination of aluminum and copper materials. The aluminum has a high thermal conductivity that helps to dissipate the heat efficiently, while the copper has a slightly higher thermal conductivity than aluminum that provides greater thermal performance. The heat sink features a unique aluminum/solvent-free production process for superior copper-aluminum bonding that optimizes heat transfer. This combination of materials ensures that the ATS-01A-32-C2-R0 heat sink is capable of dissipating even the highest levels of heat while providing maximum reliability.
The ATS-01A-32-C2-R0 heat sink also incorporates a mounting system that allows the user to easily attach the sink to any device. The sink utilizes standard threading for mounting the various components, which makes installation easy. The mounting system also provides a secure and reliable connection between the heat sink and the device.
The ATS-01A-32-C2-R0 heat sink is designed to provide superior thermal performance in a wide range of applications. It is ideal for use in high-powered LED and power converter applications, as well as for processors and controllers. The heat sink is also ideal for high-temperature environments, such as those found in telecommunications, automotive, and device testing applications.
The ATS-01A-32-C2-R0 heat sink is designed to operate at temperatures between -40°C and +150°C, which ensures reliable operation even in extreme environments. The sink also features an innovative design that utilizes a highly rigid aluminum construction for maximum heat transfer and silent operation.
In summary, the ATS-01A-32-C2-R0 heat sink is a cost-effective, high-performance thermal solution for a variety of applications. Its unique combination of aluminum and copper materials ensures reliable performance in a wide range of temperatures. The innovative mounting system makes installation easy, while the highly rigid aluminum construction allows for maximum heat transfer and silent operation. Furthermore, the ATS-01A-32-C2-R0 heat sink is designed to provide superior performance in high-powered LED and power converter, processor and controller applications, as well as in device testing and automotive applications.
The specific data is subject to PDF, and the above content is for reference