| Allicdata Part #: | ATS-01A-53-C1-R0-ND |
| Manufacturer Part#: |
ATS-01A-53-C1-R0 |
| Price: | $ 3.79 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X30MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01A-53-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.44736 |
| 30 +: | $ 3.35433 |
| 50 +: | $ 3.16802 |
| 100 +: | $ 2.98166 |
| 250 +: | $ 2.79531 |
| 500 +: | $ 2.70213 |
| 1000 +: | $ 2.42260 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.52°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is a critical factor to consider when selecting a suitable thermal device. Heat sinks are an essential element of any cooling system used in industrial applications, and the ATS-01A-53-C1-R0 is a high-performance thermal heat sink designed to provide a reliable solution for heat dissipation. This device is the perfect choice for those who need a reliable cooling solution.
The ATS-01A-53-C1-R0 is an extruded-fin aluminum heat sink with a corrugated aluminum sheet base plate. This heat sink is designed to provide excellent thermal performance and to meet the demands of high heat flux application requirements. The device features a unique fin pattern to enhance thermal performance while ensuring that the fan blade utilizes the maximum possible air flow. The fin pattern also ensures that the air flow is evenly distributed throughout the entire heat sink to ensure optimal heat dissipation. The device also has an integrated heat spreader that helps to dissipate heat more efficiently.
The device utilizes advanced thermodynamic techniques to maximize heat transfer from the electronics module to the surrounding environment. The heat transfer is achieved by dissipating heat energy through the metal fins. The fins of the device are designed to reduce the thermal resistance between the heat source and the ambient environment. This allows the heat to be dissipated more quickly and it also reduces the temperature surge associated with traditional heat sinks.
The device offers superior performance over traditional heat sinks due to its low thermal resistance. The low thermal resistance of the device allows for higher maximum power dissipation than standard heat sinks, which increases performance and reliability. The device also provides a cooler working environment for electronics components, which helps extend their life spans.
The device also features an optimized air intake and exhaust system to ensure maximum airflow and lower system noise. The device is designed to provide optimum cooling at any speed, providing more efficient heat dissipation. The device also includes a back-plate to ensure better heat dissipation. The back-plate also reduces the risk of the heat sink becoming dislodged due to vibration.
The device can be used in a range of applications, including consumer electronics, industrial electronics, telecommunications, and automotive electronics. The ATS-01A-53-C1-R0 is an ideal choice for applications requiring comprehensive thermal management. The device offers superior performance, reliability, and the ability to meet the demands of high heat flux applications. With its high thermal performance, the device is the perfect choice for those who require a reliable cooling solution for their thermal management requirements.
The specific data is subject to PDF, and the above content is for reference