Allicdata Part #: | ATS-01A-57-C1-R0-ND |
Manufacturer Part#: |
ATS-01A-57-C1-R0 |
Price: | $ 3.45 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 35X35X20MM L-TAB |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ATS-01A-57-C1-R0 Datasheet/PDF |
Quantity: | 1000 |
10 +: | $ 3.13866 |
30 +: | $ 3.05361 |
50 +: | $ 2.88401 |
100 +: | $ 2.71435 |
250 +: | $ 2.54470 |
500 +: | $ 2.45987 |
1000 +: | $ 2.20541 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 1.378" (35.00mm) |
Width: | 1.378" (35.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.790" (20.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 13.13°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
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Heat sinks are a vital component in many electronic and electrical systems. Without them, these systems would not be able to perform their intended functions. ATS-01A-57-C1-R0 is a highly efficient thermal heat sink designed for applications where weight, size, and level of cooling are a primary concern.
This heat sink is made from beryllium copper alloy that lends itself to being welded to a base or mother board. The beryllium copper alloy has superior thermal properties compared to other metals, allowing for the heat from the electronics to be dissipated faster than other materials. This heat sink has an external surface that is 95% pure copper for maximum heat dissipation. It also has a fully anodized finish that helps protect it from corrosion and increases its performance.
The ATS-01A-57-C1-R0 is designed for installation of both active and passive cooling systems. It features an integrated fan that can be powered by either a 12V or 24V DC power source. This fan is capable of moving up to 30 cubic feet of air per minute, providing efficient cooling for a wide array of electronic components. Additionally, this heat sink can be mounted in multiple orientations, allowing for greater flexibility during installation.
The ATS-01A-57-C1-R0 has a simple but efficient working principle. When the fan is in operation, it circulates air through the heat sink, transferring the heat away from the components and into the air surrounding it. This air then spills out of the sides, eliminating the heat from the electronic device. The fan also serves to reduce the effects of air turbulence, allowing for a more efficient cooling process.
The ATS-01A-57-C1-R0 is a particularly useful thermal heat sink when used in areas where space is limited. It is lightweight, durable, and allows for improved heat dissipation compared to other heat sinks. This makes it an ideal choice for applications where cooling performance is a primary concern.
In general, the ATS-01A-57-C1-R0 is a high-performance thermal heat sink solution that has a range of benefits, making it the perfect choice for applications requiring efficient cooling. It is highly reliable and can be adapted to fit many types of electronic systems. With a simple and efficient working principle, this thermal heat sink can help maximize the efficiency of your system while keeping it running at optimal temperatures.
The specific data is subject to PDF, and the above content is for reference