| Allicdata Part #: | ATS2806-ND |
| Manufacturer Part#: |
ATS-01A-67-C2-R0 |
| Price: | $ 4.33 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01A-67-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.93750 |
| 10 +: | $ 3.82851 |
| 25 +: | $ 3.61595 |
| 50 +: | $ 3.40326 |
| 100 +: | $ 3.19051 |
| 250 +: | $ 2.97781 |
| 500 +: | $ 2.76511 |
| 1000 +: | $ 2.71193 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 20.30°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is a vital aspect of modern engineering projects. It is especially of importance in technology fields related to electronics, where wasted heat can impact performance and stability. Heat sinks, and more specifically ATS-01A-67-C2-R0, is a commonly used thermal management solution. In this article, we will discuss the application fields and working principle of ATS-01A-67-C2-R0.
Heat sinks, such as ATS-01A-67-C2-R0, are widely used for thermal management of high-power electronic devices. Heat sinks are passive heat exchangers that are used to dissipate heat away from the source heat-generating component. The ATS-01A-67-C2-R0 heat sink is an optimized solution for managing high power components by utilizing their active cooling design. It features an integrated aluminum extrusion that has been designed specifically to ensure efficient heat removal from the device.
The aluminum extrusion of the ATS-01A-67-C2-R0 lead to its improved performance, when compared to other heat sink solutions. The extrusion is constructed with larger channels that are designed to help acquire more effective airflow. This, in turn, allows for improved thermal performance. The design also includes a number of grooves, which make it possible to optimize airflow and reduce the amount of air resistance. This design feature increases the effectiveness of the heat sink in dissipating heat.
In addition, the ATS-01A-67-C2-R0 also features a number of fins to ensure efficient heat transfer. The fins are placed perpendicularly and can act as radiators. The increased surface area of the fins helps to dissipate heat more effectively. This ensures that the device remains cool, even when subjected to high power consumption. In addition, the fins also act as a thermosiphon, allowing for improved convection cooling.
The ATS-01A-67-C2-R0 is a great choice for thermal management of high power electronic devices. Its improved design allows it to perform well in applications that require heat removal from difficult to access locations. Its active cooling design helps to ensure that it does not compromise performance and stability. The aluminum extrusion and fins also help improve its thermal performance, allowing for efficient heat dissipation from the heat-generating component. This makes the ATS-01A-67-C2-R0 a great choice for thermal management solutions.
In conclusion, the ATS-01A-67-C2-R0 heat sink is a great solution for managing heat from high power components. Its active cooling design and improved fins make it an effective solution for dissipating heat. It is a great choice for applications that require efficient dissipation of heat from difficult to access locations. With its improved design, the ATS-01A-67-C2-R0 heat sink is an effective solution for thermal management projects.
The specific data is subject to PDF, and the above content is for reference