ATS-01A-70-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	8.69°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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ATS-01A-70-C1-R0 Thermal - Heat Sinks Applications and Working Principle

The ATS-01A-70-C1-R0 Thermal - Heat Sinks is a type of device that is designed to transfer and disperse heat away from electronic components. This heat sink is often used to reduce temperatures in applications such as electrical assemblies, burn-in test socket, and automotive electronics. In some cases, it is also used as an airflow barrier between two components. To better understand how this type of device works and what benefits it provides, let’s take a look at the various components and the working principle behind the ATS-01A-70-C1-R0 Thermal - Heat Sinks.

Components

The ATS-01A-70-C1-R0 Thermal - Heat Sinks consists of three main components - a heat sink base, a mounting bracket and a thermal interface material. The base of the heat sink is made of aluminum alloy and has fins of various sizes and patterns to help dissipate the heat away from the device. The mounting bracket is designed to fit the size and shape of any electronic component and provide an easy and secure way to mount the heat sink to the device. The thermal interface material is a layer of heat-conductive material sandwiched (or clamped) between the heat sink base and the component. It helps transfer the heat away from the hot component and towards the heat sink where it can be dispersed.

Working Principle

The ATS-01A-70-C1-R0 Thermal - Heat Sinks works on the principle of conduction. The thermal interface material works by transferring the heat away from the component and towards the heat sink, where it is dissipated. The fins on the surface of the heat sink help to dissipate the heat into the surrounding air by providing additional surface area for the heat to escape. The mounting bracket allows for the secure attachment of the heat sink to the device, which helps further increase the surface area for heat transfer.

Benefits of ATS-01A-70-C1-R0 Thermal - Heat Sinks

The ATS-01A-70-C1-R0 Thermal - Heat Sinks provides several benefits in terms of temperature control and component longevity. By transferring the heat away from the device, the temperature of the device is kept lower, which increases the lifespan of the components and reduces the risk of failure. The fins on the heat sink also help to dissipate the heat further, which improves the cooling performance and keeps the device cooler. Furthermore, the mounting bracket ensures a secure and reliable fit between the device and the heat sink, which prevents thermal leakage and heat transfer inefficiencies.

Conclusion

In conclusion, the ATS-01A-70-C1-R0 Thermal - Heat Sinks is a versatile and cost effective solution for heat transfer and temperature control. It uses a combination of materials and a mounting bracket to efficiently dissipate the heat away from the component and keep temperatures low. With its reliable performance and long lifespan, the ATS-01A-70-C1-R0 Thermal - Heat Sinks is an ideal choice for a variety of applications.

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