| Allicdata Part #: | ATS2847-ND |
| Manufacturer Part#: |
ATS-01B-09-C2-R0 |
| Price: | $ 4.07 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X20MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01B-09-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.69810 |
| 10 +: | $ 3.59730 |
| 25 +: | $ 3.39746 |
| 50 +: | $ 3.19763 |
| 100 +: | $ 2.99773 |
| 250 +: | $ 2.79788 |
| 500 +: | $ 2.59803 |
| 1000 +: | $ 2.54807 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.58°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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A heat sink is a device that efficiently transfers heat from one object to another, where the heat source is dissipated away from the component being cooled. Heat sinks are commonly used in electronics to dissipate unwanted heat generated by electrical components. The ATS-01B-09-C2-R0 is a thermal heat sink designed to effectively transfer heat with greater efficiency than traditional heat sinks and dissipate the heat away from the electronic components.
The ATS-01B-09-C2-R0 thermal heat sink consists of a thermally conductive aluminum base and an aluminum finstack that increases the surface area for heat dissipation. The fins are designed with a surface texture pattern that dramatically reduces air turbulent flow by 20%, thus increasing the rate at which heat can be transferred away from the source. The thermally conductive aluminum base is designed to create a tight thermal contact between the heat-producing source and the finstack, which ensures efficient heat transfer.
The ATS-01B-09-C2-R0 heat sink features an optimized fin design for superior heat dissipation. The fins are arranged using advanced computational fluid dynamics (CFD) air flow analysis to maximize cooling performance. The fins are also designed to direct airflow toward components that need cooling, allowing even hard-to-reach components to be cooled effectively.
The ATS-01B-09-C2-R0 uses copper-based oxide films to increase transfer efficiency and reduce air resistance. This feature helps reduce temperature gradients while providing maximum protection from oxidation, corrosion, and other environmental conditions. Additionally, the heat sink is designed to be EMC/ESD compatible, making it suitable for use in mission-critical applications with strict requirements.
The ATS-01B-09-C2-R0 thermal heat sink is designed to provide the best performance in applications ranging from small LED lighting to large industrial equipment. It is highly effective in cooling heavy-duty electronic components such as processors, voltage regulators, and DC/DC converters. Additionally, the ATS-01B-09-C2-R0 can also be used in applications requiring precision temperature control, such as thermal management for medical electronics and other sensitive applications.
The ATS-01B-09-C2-R0 is an effective and reliable thermal heat sink that offers high efficiency and excellent performance in a wide range of applications. It provides superior heat dissipation, optimal air flow mechanics, and superior environmental protection. This thermal heat sink is an ideal solution for all types of electronics cooling needs.
The specific data is subject to PDF, and the above content is for reference