ATS-01B-10-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-01B-10-C3-R0-ND

Manufacturer Part#:

ATS-01B-10-C3-R0

Price: $ 3.93
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X25MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-01B-10-C3-R0 datasheetATS-01B-10-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.57399
30 +: $ 3.37554
50 +: $ 3.17696
100 +: $ 2.97845
250 +: $ 2.77989
500 +: $ 2.58133
1000 +: $ 2.53168
Stock 1000Can Ship Immediately
$ 3.93
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.99°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal-heat sinks are key components for the efficient operation of electronic components. Not only do they offer protection from overheating caused by unusually high temperatures, but they also keep components from reaching a dangerously hot state. The ATS-01B-10-C3-R0 is a high-grade thermal-heat sink that offers premium protection and expansive applications.

The ATS-01B-10-C3-R0 is made with aluminum-plastic material that is designed to dissipate heat quickly and evenly. This is achieved by its flat and wide form factor, which creates more area for contact with the surrounding air. This allows it to more effectively transfer heat from the component to the air, preventing overheating. Moreover, its top surface features precision diamond-cut fins which add additional surface area while providing efficient heat dissipation. These fins are composed of a composite material that can withstand high temperatures, ensuring durability and superior thermal efficiency.

The ATS-01B-10-C3-R0\'s broad application range makes it suitable for a variety of machines. Its flat form factor makes it ideal for use in high-power electronic components, helping to keep their temperatures low in order to improve performance and extend the life of the components. It is also suitable for use in computers, power supplies, and other power-related systems and devices. It even works with fans to keep air resistance low and achieve maximum cooling performance.

The ATS-01B-10-C3-R0 has an optimized working principle that allows it to efficiently transfer heat and keep components cool. Its construction allows air to flow inside the diamond-cut fin structure, resulting in even more area for heat transfer. This increased area allows for effective heat dissipation from the heatsink while simultaneously providing low air resistance, which in turn increases cooling efficiency. As air passes between the fins, it helps to dissipate heat from the components to the surrounding air, ensuring that temperatures remain low and components from getting too hot.

The ATS-01B-10-C3-R0 is a reliable and efficient thermal-heat sink that is perfect for a variety of applications. Its construction provides protection from overheating and ensures that components remain cool during operation. Its broad application range makes it suitable for a variety of machines, providing high performance and expansive use. By utilizing an optimized working principle, it is able to quickly and effectively transfer heat away from components while providing low air resistance. In conclusion, the ATS-01B-10-C3-R0 is the perfect thermal-heat sink for any application.

The specific data is subject to PDF, and the above content is for reference

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