ATS-01B-106-C3-R1 Allicdata Electronics
Allicdata Part #:

ATS-01B-106-C3-R1-ND

Manufacturer Part#:

ATS-01B-106-C3-R1

Price: $ 4.94
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X40X12.7MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-01B-106-C3-R1 datasheetATS-01B-106-C3-R1 Datasheet/PDF
Quantity: 1000
10 +: $ 4.44150
30 +: $ 4.19496
50 +: $ 3.94808
100 +: $ 3.70138
250 +: $ 3.45462
500 +: $ 3.20786
1000 +: $ 3.14617
Stock 1000Can Ship Immediately
$ 4.94
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Rectangular, Fins
Length: 1.772" (45.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.500" (12.70mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 26.70°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is one of the key challenges of modern technology and electronic devices. Over time, as technology advances, and the components become more complex and powerful, the amount of heat generated also increases. This makes it necessary to have efficient and reliable cooling solutions in order to keep the components at optimal temperatures.

One of the most popular and reliable solutions to this problem is the ATS-01B-106-C3-R1 heat sink. It is a highly efficient and cost-effective option for thermal management. The heat sink is designed with special features such as an optimized fin array, distinctive fin pitch, and a unique shape that helps to dissipate heat. It is made from high-quality aluminum alloy that has superior strength and corrosion resistance.

The operation of the ATS-01B-106-C3-R1 heat sink is based on the principle of heat dissipation. Heat is generated and dissipated from the surface of the component. The heat sink helps to pull the heat away from the component and release it into the atmosphere. This helps to keep the temperature of the component within safe limits.

This heat sink is widely used in a variety of applications and industries. It is especially useful in applications where precision cooling is required, such as high-performance computer systems, industrial systems, and medical devices. It is also suitable for use in small electronic devices that require efficient thermal management.

The ATS-01B-106-C3-R1 heat sink is easy to install and use. It is designed with thermal resistance and heat transfer characteristics that make it easy to install and ensure a secure connection. The design also allows for components to be mounted securely on the heat sink without the need for screws or special tools.

Overall, the ATS-01B-106-C3-R1 is an efficient, cost-effective, and reliable heat sink solution for thermal management. It is suitable for a variety of applications and can help to keep electronic components at safe temperatures.

The specific data is subject to PDF, and the above content is for reference

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