| Allicdata Part #: | ATS-01B-115-C1-R0-ND |
| Manufacturer Part#: |
ATS-01B-115-C1-R0 |
| Price: | $ 3.23 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X20MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01B-115-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.93643 |
| 30 +: | $ 2.85705 |
| 50 +: | $ 2.69829 |
| 100 +: | $ 2.53953 |
| 250 +: | $ 2.38085 |
| 500 +: | $ 2.30148 |
| 1000 +: | $ 2.06339 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.31°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-01B-115-C1-R0 infrared thermal module is a high-quality thermal solution for a wide range of applications that require thermal management. It is a complete solution, offering excellent performance in a compact size. This module can be used in a variety of applications, including medical, industrial and home applications.
The ATS-01B-115-C1-R0 is designed for use in a variety of thermal management applications that require the efficient transfer of heat from an object to another. This module utilizes an advanced heat-sink and fans combination to ensure efficient thermal management. The module is constructed of a high-performance heat sink and fans that are designed to provide the best thermal management possible. The combination of the fan and the heat sink help to maximize the thermal performance while minimizing the power consumption.
The ATS-01B-115-C1-R0 offers a variety of benefits over standard heat sink solutions. It is designed to offer improved heat transfer efficiency. This is achieved at a lower cost, because the use of the fan and the heat sink eliminates the need for additional fans. Additionally, the ATS-01B-115-C1-R0 module also offers improved airflow and heat dissipation to help keep the object cooler, even when temperatures rise to elevated levels.
The thermal module is designed to be used in applications such as personal computers, small electronic systems, and consumer products. The module is designed to be compatible with a variety of system architectures. For example, it can be used with either direct heat sink mount or air-blown fan heat sinks, depending on the system needs and architecture. The module is also designed with a variety of heat sink levels to accommodate different heat load requirements.
The module is designed to provide a reliable and efficient thermal solution for a variety of applications. To ensure optimal performance, it is important to understand the working principle of the module. The fan and the heat sink together generate a heat flux that is transferred to the object. This heat flux is then dissipated away from the object, allowing for a cooler environment. This heat transfer process is achieved through the use of two independent optical sensors that detect the temperature of the object and its surroundings. The temperature sensors then adjust the fan speed and heat sink level to maintain an optimal temperatures for the application.
The ATS-01B-115-C1-R0 is a reliable and efficient thermal solution that can be used in a variety of applications. It offers excellent performance at a fraction of the cost of other thermal solutions. The module is designed to provide excellent thermal performance and efficiency, while minimizing power consumption. This makes it an ideal choice for a variety of thermal management applications, including medical, industrial, and home applications.
The specific data is subject to PDF, and the above content is for reference