ATS-01B-115-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.575" (40.00mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.790" (20.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	5.45°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction to the ATS-01B-115-C3-R0 Thermal Heat Sink

The ATS-01B-115-C3-R0 Thermal Heat Sink is a top of the line solution for efficient heat transfer. It is designed to offer maximum cooling performance, ensuring power is released quickly and effectively. With its user-friendly operation, the device is great for both amateur and professional users.

What is a Heat Sink?

Heat sinks are passive devices that draw heat away from other objects or components and conducts it away into the environment. These devices are usually made from solid materials such as aluminum which have been optimized to encourage cooling. Heat sinks are incredibly versatile, able to handle high temperatures, and are a great choice for any application where heat transfer needs to be taken into consideration.

The ATS-01B-115-C3-R0 Thermal Heat Sink

The ATS-01B-115-C3-R0 Heat Sink is designed to be the complete package when it comes to keeping up with modern technology. With its dual-fanned design, the device is made to dissipate heat more efficiently. The large surface area of the heat sink also helps spread the heat evenly, and the fins provide plenty of ventilation space, with an air flow rate of up to 5CFM.The thermal heat sink also has an efficient passive cooling system, ensuring maximum heat transfer from the components. The high-quality copper design provides superior conductivity, and ensures the heat transfer that takes place between the heat sink and the components.The heat sink is also designed to be user-friendly, with its easy to operate mounting system and adjustable height. It features a tool-less installation process, allowing users to install and detach the heat sink quickly and easily. The device also has a compact design, ensuring it does not take up too much space on the board.

ATS-01B-115-C3-R0 Application Field and Working Principle

The ATS-01B-115-C3-R0 is designed to be used in a range of applications, such as aerospace, automotive, consumer electronics, and other fields that require high-temperature performance. It is particularly useful for applications where components need to be cooled quickly and efficiently.The working principle of the ATS-01B-115-C3-R0 Thermal Heat Sink is simple but effective. The surface area and the fan speed of the device encourages heat to escape quickly and effectively, and the fins act as vents, allowing hot air to escape and cold air to enter the device. The copper provides superior conductivity, which also helps to disperse heat from the components more readily. This allows the device to provide effective cooling in a wide range of conditions.

Conclusion

The ATS-01B-115-C3-R0 Thermal Heat Sink is a great choice for anyone in need of an efficient cooling solution. With its user-friendly design, it’s great for both novice and experienced users. Its clearly superior cooling performance ensures components remain cool and efficient over prolonged usage. Its wide range of applications makes it a great investment for businesses and individuals alike.

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