ATS-01B-121-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-01B-121-C3-R0-ND

Manufacturer Part#:

ATS-01B-121-C3-R0

Price: $ 3.70
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 50X50X10MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-01B-121-C3-R0 datasheetATS-01B-121-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.36420
30 +: $ 3.27348
50 +: $ 3.09154
100 +: $ 2.90972
250 +: $ 2.72785
500 +: $ 2.63691
1000 +: $ 2.36412
Stock 1000Can Ship Immediately
$ 3.7
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.969" (50.00mm)
Width: 1.969" (50.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 9.56°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

.

Thermal management is a vital consideration for any electronic system running at higher performance than ambient temperatures. In a highly competitive global market, thermal management solutions need to be reliable, cost effective, and easy to implement. The ATS-01B-121-C3-R0 is a thermal management solution that meets these criteria and provides a range of benefits for designers looking for a flexible, reliable solution for their high performance systems.

The ATS-01B-121-C3-R0 is a thermal heat sink designed for use in a variety of applications and is designed to provide active cooling and effective heat dissipation to keep the electronic components in the system at a lower operating temperature. The ATS-01B-121-C3-R0 is based on its predecessor, the ATS-01B-121-C3-R, but offers a range of improved features and performance.

The ATS-01B-121-C3-R0 is a heat sink designed with a custom shape to maximize thermally-induced airflow over the components in the system. The system uses a combination of direct cooling and passive convection cooling techniques to achieve effective heat dissipation. The copper core is anodized for increased surface area heat transfer and improved oxidation resistance. Additionally, the aluminum fins are precision-dipped to enhance air flow and reduce wind resistance.

The ATS-01B-121-C3-R0 features a unique copper-to-aluminum composite material construction that provides superior thermal properties and performance. This material enables the entire surface area of the heat sink to be cooled evenly and consistently, and the system is able to dissipate far more heat than conventional heat sinks. This makes the ATS-01B-121-C3-R0 a particularly suitable option for complex systems that require superior cooling performance.

The ATS-01B-121-C3-R0 is designed to be reliable and long-lasting. The anodized copper core ensures long-term durability and the aluminum fins are designed for minimal degradation over time. The design of the ATS-01B-121-C3-R0 also enables efficient installation and maintenance, and the system can be easily kept clean and functioning to ensure the highest levels of durability and performance.

The ATS-01B-121-C3-R0 is a highly versatile thermal-management solution that can be used in a variety of applications. Its flexible design is suitable for use in a range of devices including consumer electronics, medical devices, industrial equipment, and automotive systems. The ATS-01B-121-C3-R0 is a reliable and cost effective solution for designers seeking a high-performance thermal management solution.

The specific data is subject to PDF, and the above content is for reference

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