| Allicdata Part #: | ATS-01B-123-C3-R0-ND |
| Manufacturer Part#: |
ATS-01B-123-C3-R0 |
| Price: | $ 3.86 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X20MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01B-123-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.50469 |
| 30 +: | $ 3.31002 |
| 50 +: | $ 3.11535 |
| 100 +: | $ 2.92062 |
| 250 +: | $ 2.72591 |
| 500 +: | $ 2.53120 |
| 1000 +: | $ 2.48253 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.24°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Semiconductors are becoming increasingly present in modern technology, especially with the ubiquity of microelectronics such as microcontrollers and other integrated circuits. Thermal management solutions, such as ATS-01B-123-C3-R0, are essential to optimally dissipate the heat generated by the semiconductor, hence ensuring its optimal functioning. ATS-01B-123-C3-R0, in particular, belongs to the Thermal - Heat Sink category, which can be effectively used to reduce the temperature of semiconductors or other electronic components.
ATS-01B-123-C3-R0 is a thermoelectric thermal solution designed to provide efficient heat dissipation to large surface areas. This thermal solution is designed to operate in temperatures from -20°C to +150°C and utilizes a heat sink block made of aluminum which helps dissipate heat along the length of the whole surface area to ensure maximum heat transfer. Additionally, the block can be soldered to the target component with thermal epoxy and thermal pads to enhance heat conduction efficiency. Furthermore, the heat sink block also consists of an efficient active cooling system with fans included to ensure optimal heat dissipation, even in extreme environmental conditions.
Aside from its application in thermal management, ATS-01B-123-C3-R0 is also used to protect delicate electronic components from static electricity and electromagnetic interference (EMI). The heat sink block design includes electro-thermal shielding layers that offers excellent protection from electromagnetic radiation, and its copper-clad aluminum material provides much needed protection against electrostatic discharges.
The working principle behind the ATS-01B-123-C3-R0 is quite simple. The heat sink itself consists of a large metal plate that acts as a dissipater and a fan-driven heat expeller. The heat generated by the component is transferred to the dissipater via thermal contact and the fans then dissipate the heat away from the component. This ensures that the temperature of the component is kept in check, and prevents it from overheating and malfunctioning.
Overall, the ATS-01B-123-C3-R0 thermal solution offers excellent performance and features suitable for various applications. Its wide range of temperature performance along with excellent protection against EMI and electrostatic discharges make it perfect for use in industrial, medical and military applications, making it a very reliable option for thermal management solutions. Its easy installation and affordability further make it highly popular among users.
The specific data is subject to PDF, and the above content is for reference