ATS-01B-166-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS2921-ND

Manufacturer Part#:

ATS-01B-166-C2-R0

Price: $ 3.40
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 25X25X15MM R-TAB T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-01B-166-C2-R0 datasheetATS-01B-166-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 3.08700
10 +: $ 3.00762
25 +: $ 2.92648
50 +: $ 2.76381
100 +: $ 2.60127
250 +: $ 2.43868
500 +: $ 2.35738
1000 +: $ 2.11351
Stock 1000Can Ship Immediately
$ 3.4
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 0.984" (25.00mm)
Width: 0.984" (25.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.590" (15.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 12.18°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The ATS-01B-166-C2-R0 is widely used in a diverse range of thermal - heat sink applications. This highly efficient and reliable device is designed to provide optimized cooling capabilities, while also ensuring reliability and durability. It is designed to provide an optimal thermal solution for various electronics and other components that are prone to high temperatures. With its dual fan design, the ATS-01B-166-C2-R0 is ideal for applications with limited space or in high-vibration environments.

The ATS-01B-166-C2-R0 is made up of two main components – a heat sink and fan. The heat sink is designed to efficiently absorb and dissipate the heat energy generated by the components that it is cooling. This ensures that the operation of the devices in use remain safe and stable. The fan is used to ensure that the thermal energy is quickly and evenly distributed throughout the heat sink, providing a smooth and consistent cooling performance.

The ATS-01B-166-C2-R0 is designed to provide superior heat dissipation and cooling performance, even in extreme environmental conditions. It is constructed from a strong and lightweight aluminum alloy that is able to tolerate temperatures up to 300°F. This robust construction allows the device to provide optimal thermal performance even in challenging conditions, such as when dealing with highly dense components.

The ATS-01B-166-C2-R0 is designed to be plug-and-play, and simple to install in any application. It features a highly efficient built-in fan, which draws in hot air and then pushes it out at a much cooler temperature. This ensures that temperatures inside the device remain stable and consistent, regardless of the environmental conditions outside.

The ATS-01B-166-C2-R0 features a built-in thermal management system, which is designed to monitor and regulate the temperature of the device. The internal heatsink is designed to effectively dissipate heat ensuring that internal components remain at optimal temperatures. This ensures the longevity of the device and that components are not damaged by high temperatures.

The ATS-01B-166-C2-R0 is designed to be very user-friendly and easily installable. The built-in fan and thermal management system make it ideal for use in a wide variety of applications, ensuring that heat is quickly and efficiently removed from components. This not only helps to increase the overall performance of the device, but also helps to maximize its lifespan.

The ATS-01B-166-C2-R0 provides a highly efficient and reliable thermal solution for any application. Its powerful and efficient design helps to ensure that components remain cool and stable, even in challenging environments, as well as providing superior cooling performance for any device. This versatile and reliable device is ideal for applications ranging from small to large, helping to maximize performance, as well as the life of the device.

The specific data is subject to PDF, and the above content is for reference

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