| Allicdata Part #: | ATS2925-ND |
| Manufacturer Part#: |
ATS-01B-17-C2-R0 |
| Price: | $ 4.56 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X12.7MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01B-17-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.13910 |
| 10 +: | $ 4.02507 |
| 25 +: | $ 3.80167 |
| 50 +: | $ 3.57802 |
| 100 +: | $ 3.35437 |
| 250 +: | $ 3.13075 |
| 500 +: | $ 2.90712 |
| 1000 +: | $ 2.85122 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.44°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are used in a wide range of applications, but one type that is becoming increasingly important is the ATS-01B-17-C2-R0. It is a thermal-heat sink that is used to dissipate heat. The heat sink is designed to provide an effective and efficient solution for cooling components, such as processors, graphics cards, and other integrated circuits.
The ATS-01B-17-C2-R0 is a thermal-heat sink with an incoming air pressure of 17.5 Pa and a maximum current ratings of 10 A. The heat sink is constructed using a high-grade aluminum alloy and features grooves on its base plate for attaching components. The heat sink\'s design also includes a finned body and multiple lugs, which provide a large number of contact points for effective conduction of heat.
The thermal-heat sink also includes a variety of cooling fins to enable efficient heat dissipation. The fins help to dissipate the heat by transferring it away from the components and into the air. The heat sink also features a large surface area to further increase the dissipation of heat. The surface area is maximized by using multiple layers of fins, which help to ensure that heat is more evenly distributed.
The ATS-01B-17-C2-R0 is designed to work best when installed in areas that have good airflow. This allows the fins on the heat sink to do their job effectively, as they are more likely to be exposed to sufficient amounts of air. The fins also need to be kept clean, as dirt and debris can impede heat dissipation. This is especially important for cooling applications where heat needs to be quickly dissipated in order to keep the components from overheating.
The ATS-01B-17-C2-R0 thermal-heat sink is designed to provide an effective and efficient cooling solution for electrical and electronic components. It features high-grade aluminum construction, increased surface area, and multiple cooling fins to ensure effective heat dissipation. Good airflow must be provided to ensure that the heat is efficiently dissipated. The heat sink is also easy to install, making it an ideal choice for a wide range of applications.
The specific data is subject to PDF, and the above content is for reference