| Allicdata Part #: | ATS-01B-175-C3-R0-ND |
| Manufacturer Part#: |
ATS-01B-175-C3-R0 |
| Price: | $ 3.78 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X10MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01B-175-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.43539 |
| 30 +: | $ 3.34278 |
| 50 +: | $ 3.15706 |
| 100 +: | $ 2.97140 |
| 250 +: | $ 2.78568 |
| 500 +: | $ 2.69282 |
| 1000 +: | $ 2.41425 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 13.65°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management through heat sinks has become an increasingly important factor in the electronics industry. The ability of these components to absorb heat generated by electronic devices and disperse it into the environment has been key to sustaining longer lifespan from computers, processors, and other components found in a wide range of applications. The ATS-01B-175-C3-R0 heat sink is designed to provide superior heat dissipation in a durable, compact form factor.
Materials
The ATS-01B-175-C3-R0 uses aluminum in its construction, providing 70-80 Watts of heat dissipation. Its size is approximately 175mm x 50mm x 25mm, with an extruded fin stack. The heat sink has a natural anodized finish, resulting in a smooth, matte, sun-protected, corrosion resistant surface. Both copper and aluminum mounting screws are included.
Application Field and Working Principle
The ATS-01B-175-C3-R0 is ideal for a variety of different types of electronics in its operational environment, including computers, communication devices, and consumer electronics. Its construction facilitates excellent heat dissipation, with the aluminum fin stack serving to absorb and dissipate heat from components. This is done by pushing the heat away from the components into an environment outside the component, allowing it to remain cool and within its operating temperature parameters. This heat dissipation is made possible by the increased surface area of the metal fins, where the air coming in contact with the fins removes heat, before it exits towards the environment.
Installation and Maintenance
The ATS-01B-175-C3-R0 is designed for easy installation and maintenance. With the pre-drilled holes and the included mounting screws, the heat sink can be quickly and securely installed onto a range of electronic components. The impervious aluminum surfaces together with its natural anodized finish ensure it is easy to clean and maintain.
Advantages
The ATS-01B-175-C3-R0 offers a wide range of advantages when compared to other similar heat sinks, including its ability to cool and dissipate more heat more efficiently. Its compact form-factor and low profile make it perfect for tight spaces. Additionally, it is designed to withstand harsh environmental conditions, including UV exposure, chemicals and high temperatures. It also requires minimal maintenance due to its natural anodized surface, making it an ideal choice for long-term use.
Conclusion
The ATS-01B-175-C3-R0 is an effective, durable and compact heat sink which provides superior heat dissipation. It is designed to fit a variety of electronics and is easy to install and maintain, all while providing excellent protection from harsh environmental conditions. This heat sink is the ideal solution for keeping electronics cool and prolonging their lifespan.
The specific data is subject to PDF, and the above content is for reference