ATS-01B-181-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-01B-181-C1-R0-ND

Manufacturer Part#:

ATS-01B-181-C1-R0

Price: $ 3.45
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X10MM R-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-01B-181-C1-R0 datasheetATS-01B-181-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.13866
30 +: $ 3.05361
50 +: $ 2.88401
100 +: $ 2.71435
250 +: $ 2.54470
500 +: $ 2.45987
1000 +: $ 2.20541
Stock 1000Can Ship Immediately
$ 3.45
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 11.93°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The ATS-01B-181-C1-R0 is a highly versatile product within the thermal management market. The R0 series in this family is an innovative design that maximizes its potential as a thermal heat sink. In this article, we will analyze the two main features associated with this product: its application field and working principle.

Application Field

The ATS-01B-181-C1-R0 was specifically designed to achieve maximum performance and improved energy efficiency over conventional heat sink designs. This product combines engineering and design capabilities to optimize thermal performance on a predetermined application. This could include the application of a wide variety of thermal products, such as semi-conductor devices, X-ray detectors, electronic machines, and other specialized products. Its built-in mechanics makes it perfect for applications that need to be cooled down without significantly increasing the thermal design point (TDP). In other words, the ATS-01B-181-C1-R0 will be able to ensure an appropriate level of heat dissipation while maintaining a high level of reliability, durability, and performance.

Working Principle

The ATS-01B-181-C1-R0 works by transferring the heat from the source to the environment through several thermally conductive materials. This product uses an array of copper fins with an aluminum base to maximize the total surface area of the device and provide the most efficient heat transfer. The copper fins are interfaced with the aluminum base and connected with a thermal joint. The copper fins are able to capture and draw in the hot air generated by the source material and dissipate it rapidly. The aluminum base of the product acts as a heat spreader, transferring any additional heat energy to the surrounding environment. Additionally, the product has been designed to take advantage of convection cooling, which allows air to flow freely over the surface of the product and help carry away the hot air.

The ATS-01B-181-C1-R0 is a very reliable thermal heat sink and has been proven to provide excellent energy efficiency and performance. It is capable of effectively dissipating heat from a wide range of applications while keeping costs and power consumption to a minimum. Its design also makes it easy to fit into many different setups. With all these features, the ATS-01B-181-C1-R0 is an ideal solution for any thermal management need.

The specific data is subject to PDF, and the above content is for reference

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