| Allicdata Part #: | ATS-01B-197-C1-R0-ND |
| Manufacturer Part#: |
ATS-01B-197-C1-R0 |
| Price: | $ 3.12 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01B-197-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.80539 |
| 30 +: | $ 2.72979 |
| 50 +: | $ 2.57809 |
| 100 +: | $ 2.42645 |
| 250 +: | $ 2.27480 |
| 500 +: | $ 2.19898 |
| 1000 +: | $ 1.97149 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.86°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal-heat sinks are one of the most important components of any electronic device. They are used to cool down electronic components, such as microprocessors, in order to maintain their optimal functioning. The thermal-heat sinks are designed to draw heat away from the component, and dissipate it in the surrounding environment. In order to do this, they utilize a heat transfer process that uses a combination of conduction, convection, and radiation.
The ATS-01B-197-C1-R0 is a type of thermal-heat sink designed for low-power semiconductor applications. It is designed for cooling a component such as a microprocessor in a circuit board. It is a type of single-piece cast aluminum heat sink and is designed for surface mount applications. The ATS-01B-197-C1-R0 is able to dissipate heat from 0.8 Watts up to 2 Watts.
The ATS-01B-197-C1-R0 utilizes an active heat dissipation process in order to effectively cool electronics. This process involves the use of a fan, which draws air across the heat sink, absorbing the heat from the component and dissipating it in the surrounding environment. The fan attached to the ATS-01B-197-C1-R0 is powered by a small DC motor. The fan is capable of providing a maximum air flow of up to 8.6 CFM.
The ATS-01B-197-C1-R0 is designed for surface mount applications, and it is constructed using a single piece of cast aluminum. This allows it to have a low profile design that allows for easy installation and mounting. The ATS-01B-197-C1-R0 also has a wide temperature range, from -40°C up to +105°C. This makes it suitable for a wide variety of applications, including industrial, automotive, and consumer electronics.
The ATS-01B-197-C1-R0 is capable of providing an effective solution for cooling low-power semiconductor applications. Its active heat dissipation process, low profile design, and wide temperature range make it an ideal candidate for applications such as industrial, automotive, and consumer electronics. In addition, its small size makes it an ideal choice for applications where space is limited.
The specific data is subject to PDF, and the above content is for reference