
Allicdata Part #: | ATS-01B-20-C3-R0-ND |
Manufacturer Part#: |
ATS-01B-20-C3-R0 |
Price: | $ 4.67 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 54X54X25MM XCUT T412 |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
10 +: | $ 4.19895 |
30 +: | $ 3.96543 |
50 +: | $ 3.73225 |
100 +: | $ 3.49896 |
250 +: | $ 3.26570 |
500 +: | $ 3.03243 |
1000 +: | $ 2.97412 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 2.126" (54.01mm) |
Width: | 2.126" (54.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.984" (25.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 7.21°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is an important aspect of all electronics production. The thermal performance of electronic components must be managed to ensure safe operation of the component, prolonging its longevity, and ensuring proper functionality in the application. Heat sinks are an important part of thermal management, and the ATS-01B-20-C3-R0 is a reliable solution.This efficient heat sink is designed to provide maximum thermal performance. Its unique design features a combination of aluminium fins and copper heat pipes. This combination of materials maximizes surface area and improves heat dissipation. The efficient design and high material strength also makes the ATS-01B-20-C3-R0 well suited for harsh environmental conditions.The ATS-01B-20-C3-R0 is designed to dissipate heat generated by high power electronics such as CPUs and GPUs. It is able to perform operations even in extreme environmental conditions, such as temperatures of up to 155°C. The heat sink is also designed to minimize airflow restriction by featuring round vents. This allows for maximum cooling potential even with limited space. Lastly, the ATS-01B-20-C3-R0 also features an anodized surface treatment to further enhance cooling performance.In terms of application field, the ATS-01B-20-C3-R0 is an ideal choice for many electronic systems. It is suitable for use in computer systems, industrial machines, telecommunications equipment, and other applications that require efficient cooling. The heat sink is also well-suited for applications in avionics, medical equipment, military and aerospace electronics, and automotive electronics.The working principle of the ATS-01B-20-C3-R0 is based on the convection-conduction process. This process relies on efficient, given by the combination of copper heat pipes and aluminium fins, as well as airflow created by the round vents. The heat generated by the electronic components is transferred to the heat sink, and dissipated through the heat pipes and fins into the surrounding air. This process effectively cools the components, ensuring proper operation and longer lifecycles.The ATS-01B-20-C3-R0 heat sink is a robust, reliable thermal management solution. It is designed to provide maximum thermal performance in harsh environmental conditions. Its unique combination of copper heat pipes and aluminium fins also ensures efficient heat dissipation, resulting in longer component life. The heat sink is also well-suited for use in a variety of electronic systems. All of these features and benefits combined make the ATS-01B-20-C3-R0 an ideal thermal management solution.
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