ATS-01B-21-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.362" (60.00mm)
Width:	2.362" (60.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	16.28°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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ATS-01B-21-C2-R0 Thermal - Heat Sinks

Thermal - Heat Sinks are one of the most widely used types of heat dissipaters. It works by dissipating the heat from other components and circuits, using a combination of materials, such as aluminum and copper. The ATS-01B-21-C2-R0 is a thermal - heat sink designed for use in higher performance computer applications. It is a low profile, robust device which allows for a wide range of venting configurations.The ATS-01B-21-C2-R0 Thermal - Heat Sink is composed of an aluminium-fin core which is integrated with a copper slug. This copper slug is used to transfer heat away from other components and circuits, using an efficient combination of the two materials. The integrated copper slug also increases the thermal conductivity of the device.The design of the ATS-01B-21-C2-R0 Thermal - Heat Sink allows it to be used in a variety of high performance computer applications. It is particularly suitable for applications which require an extremely efficient and reliable means of heat transfer. As such, the device is often used in computer systems which require high performance, such as gaming systems and high-end workstations.The ATS-01B-21-C2-R0 Thermal - Heat Sink features a wide range of different features which make it suitable for a variety of uses. Firstly, it has an adjustable fin size which can be customized to meet the exact requirements of the application. Additionally, the device also features base plates which are designed to fit onto nearly any standard CPU socket. This allows for a wide range of different heat transfer options.The performance of the ATS-01B-21-C2-R0 Thermal - Heat Sink is determined by a combination of the design and implementation of the finning techniques, as well as the materials used in the construction of the device. The built-in copper slug increases the thermal conductivity of the device, allowing for extremely efficient heat transfer. Additionally, the adjustable fin size allows the user to customize the performance of the device, ensuring that the exact specifications of the application can be achieved.An additional advantage of the ATS-01B-21-C2-R0 Thermal - Heat Sink is the fact that it has been designed to be extremely durable. Despite the use of high quality materials, the device will not corrode or become damaged over a long period of time. This means that it is ideal for applications which require reliable, long-term heat dissipation solutions.In conclusion, the ATS-01B-21-C2-R0 Thermal - Heat Sink is an excellent choice for applications which require an extremely efficient and reliable thermal heat dissipation solution. Its adjustable fin size, copper slug and durable construction make it suitable for a wide range of applications, allowing users to tailor the device to their exact needs. Additionally, its high performance ensures that the device will be able to efficiently dissipate heat for a lengthy amount of time, making it a great choice for high performance computing applications.

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