| Allicdata Part #: | ATS-01B-24-C3-R0-ND |
| Manufacturer Part#: |
ATS-01B-24-C3-R0 |
| Price: | $ 5.40 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X20MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01B-24-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.85793 |
| 30 +: | $ 4.58808 |
| 50 +: | $ 4.31827 |
| 100 +: | $ 4.04838 |
| 250 +: | $ 3.77849 |
| 500 +: | $ 3.50860 |
| 1000 +: | $ 3.44112 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.43°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat sinks are widely used in commercial, industrial, and scientific applications in order to reduce the temperature of a component or system. ATS-01B-24-C3-R0 is a type of thermal heat sink that is specifically designed to cool down components that generate a significant amount of heat, such as high-power electronics.
The ATS-01B-24-C3-R0 thermal heat sink is made up of a base plate, a Thermal Interface Material (TIM) layer, an upper plate, and a printed circuit board (PCB). The material of the base plate and upper plate can be chosen according to the application and requirements. The TIM layer is positioned between the upper and base plates and is generally used to provide insulation and simultaneous heat transfer from the component to the heat sink.
The basic function of the ATS-01B-24-C3-R0 thermal heat sink is to dissipate heat from the device to the environment. It does this by providing a large surface area which allows heat to be transferred to the air or other medium by conduction. Airflow, typically from a fan or blower, is used to create a stream of air that passes over the heat sink, speeding up the transfer of heat.
The ATS-01B-24-C3-R0 thermal heat sink also contains a printed circuit board (PCB) that is used to control the fan speed and temperature. It contains a thermal sensor that is used to detect temperature changes, and then recalibrates the fan speed to maintain the desired temperature level. This ensures the safety and optimal functioning of the component.
In addition to active cooling by airflow, ATS-01B-24-C3-R0 also provides passive cooling through convective air currents. A chimney effect is created within the heat sink structure, with warm air being drawn up through the center of the heat sink and expelled out the top. This kind of convective cooling allows for cooler ambient air to circulate around the component, thus providing additional cooling.
Overall, the ATS-01B-24-C3-R0 thermal heat sink provides a great solution for cooling devices that generate a significant amount of heat. The combination of its active and passive cooling capabilities make it an ideal choice for many applications. With its Thermal Interface Material (TIM) layer, and its printed circuit board (PCB) providing temperature control, it is a versatile and reliable choice for keeping components operating at the optimal temperature.
The specific data is subject to PDF, and the above content is for reference