| Allicdata Part #: | ATS-01B-30-C3-R0-ND |
| Manufacturer Part#: |
ATS-01B-30-C3-R0 |
| Price: | $ 8.13 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01B-30-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 7.31934 |
| 30 +: | $ 6.88861 |
| 50 +: | $ 6.45813 |
| 100 +: | $ 6.02759 |
| 250 +: | $ 5.59705 |
| 500 +: | $ 5.48941 |
| 1000 +: | $ 5.38177 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.35°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management plays an important role in the operation of electronic components. Heat sinks are essential components in many electronic devices, including computers, laptops, and industrial controls. The ATS-01B-30-C3-R0 heat sink is a popular choice for thermal management due to its ability to efficiently remove heat from delicate components without creating noise or interfering with the function of the device.
The ATS-01B-30-C3-R0 heat sink is a passive cooling device that utilizes air flow to disperse heat away from sensitive components. It features up to sixteen sides and a total area of 270mm square. Each side has an individual fin for a total fin count of 16. These fins generate a surface area of 8,349mm2 and promote the dissipation of heat. The heat sink body is made from anodized aluminum and its fins are made from extruded aluminum.
The ATS-01B-30-C3-R0 heat sink employs a passive convection cooling technique. Heat is absorbed by the heat sink through conduction and the fins create air turbulence as air passes over them. This air turbulence transfers the heat away from the heat sink and releases it into the surrounding environment. This process of removal of waste heat ensures that the temperature of the electronic components stays within the safe operating range.
The ATS-01B-30-C3-R0 heat sink is designed for applications that require low noise levels. The fins are designed to promote silent dissipation of heat by reducing air turbulence. The design of the heat sink also eliminates the need for active components such as fans, which can add to the noise levels. Furthermore, it is a very compact design that can be mounted onto tight spaces in electronic devices. As a result, it is a popular choice for applications that require thermal management but are limited in space.
The ATS-01B-30-C3-R0 heat sink is ideal for industrial applications such as solar inverters, charge controllers, power supplies, and surge protectors. The heat sink is also used in general electronic equipment such as radios, TVs, and amplifiers. It is also a common choice for automotive applications like DC to DC converters, power supplies, and controllers. Its excellent thermal performance and noise free operation make it a popular choice for these applications.
The ATS-01B-30-C3-R0 heat sink is a reliable and efficient thermal management solution for a variety of applications. Its passive cooling technology ensures that delicate components remain within a safe operating temperature range. Its low noise, compact design is also ideal for applications that require thermal management but do not have a lot of space available. The ATS-01B-30-C3-R0 heat sink is an ideal choice for those looking for an efficient and reliable thermal solution for their electronic components.
The specific data is subject to PDF, and the above content is for reference