ATS-01B-33-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-01B-33-C1-R0-ND

Manufacturer Part#:

ATS-01B-33-C1-R0

Price: $ 5.41
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 57.9X36.83X17.78MM
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-01B-33-C1-R0 datasheetATS-01B-33-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 4.86990
30 +: $ 4.59900
50 +: $ 4.32860
100 +: $ 4.05802
250 +: $ 3.78748
500 +: $ 3.51695
1000 +: $ 3.44932
Stock 1000Can Ship Immediately
$ 5.41
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Rectangular, Fins
Length: 2.280" (57.90mm)
Width: 1.450" (36.83mm)
Diameter: --
Height Off Base (Height of Fin): 0.700" (17.78mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 17.40°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is an important consideration in many industrial and commercial applications. Heat sinks provide a means of cooling components that become too hot during operation. The ATS-01B-33-C1-R0 is a heat sink that can reduce cooling costs in industrial and commercial applications while providing superior airflow and heat transfer.

The ATS-01B-33-C1-R0 is an aluminum heat sink with a fin design. Its fins are spaced apart to allow more efficient airflow, resulting in improved cooling ability. The aluminum construction also provides excellent thermal conductivity and heat transfer. The ATS-01B-33-C1-R0 is designed for natural or forced convection cooling applications. It can be used for both air-cooled and liquid-cooled systems, allowing for maximum cooling efficiency.

The ATS-01B-33-C1-R0 heat sink has a wide range of applications, including telecommunications, computers, electrical power systems, military and aerospace, consumer electronics, and automotive. In these applications, the ATS-01B-33-C1-R0 is used to protect components from overheating by dissipating or transferring heat away from them. This helps to ensure that the components function properly and safely.

The ATS-01B-33-C1-R0 works by absorbing heat from the component and transferring it to the surrounding air or liquid. The aluminum fins on the heat sink enhance heat dissipation by increasing the surface area, allowing more efficient heat transfer. As air or liquid passes over the heat sink’s fins, the heat is absorbed and transferred away from the component. The air or liquid then carries the heat away from the component, effectively cooling it.

The ATS-01B-33-C1-R0 is designed for easy installation and can be installed in a variety of configurations depending on the application. For air-cooled systems, the heat sink can be mounted directly onto the component. For liquid-cooled systems, the heat sink can be connected to a water block or fan. The heat sink can also be mounted in a chassis or in a fan mount for optimal cooling efficiency.

The ATS-01B-33-C1-R0 is designed to optimize cooling by providing superior airflow and heat transfer. Its fin design increases the surface area for improved heat transfer, while its aluminum construction provides excellent thermal conductivity. This makes the ATS-01B-33-C1-R0 ideal for cooling components in a variety of applications, from telecommunications to automotive.

The specific data is subject to PDF, and the above content is for reference

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