| Allicdata Part #: | ATS-01B-36-C3-R0-ND |
| Manufacturer Part#: |
ATS-01B-36-C3-R0 |
| Price: | $ 5.68 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 36.83X57.6X11.43MM T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01B-36-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.11245 |
| 30 +: | $ 4.82853 |
| 50 +: | $ 4.54444 |
| 100 +: | $ 4.26044 |
| 250 +: | $ 3.97641 |
| 500 +: | $ 3.69238 |
| 1000 +: | $ 3.62137 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.450" (36.83mm) |
| Width: | 2.267" (57.60mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.450" (11.43mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 14.90°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important factor in ensuring the reliable operation of any electronic device. Heat sinks are one of the best long-term solutions for thermal management because they can drastically improve a system’s overall efficiency and provide plenty of thermal protection. The ATS-01B-36-C3-R0 Heat Sink is a robust and reliable heat sink that has been designed to provide top-tier performance for temperature control in a wide range of electrical and electronic applications.
The ATS-01B-36-C3-R0 has been designed with customer convenience and performance in mind, and can be easily integrated into existing systems. It features a high-performance aluminum base with a flat-top design, and comes with an integrated thermal pad for easy installation. The design also includes an extended center-to-center spacing, which allows for superior heat dissipation even under extreme conditions. The unique design ensures that the heat generated by the device or system is quickly dissipated and there is virtually no thermal energy accumulation in the device
The ATS-01B-36-C3-R0 has a wide range of application fields, such as power supplies, high-tech electronics, military electronics, and medical devices. It can also be used for advanced current-sensing applications, where it can precisely control the temperature of the circuit without any additional components. Furthermore, it can be used for cooling unattended systems such as liquid crystal displays, computer motherboards, and medical equipment.
In terms of working principle, the ATS-01B-36-C3-R0 makes use of advanced thermal conduction principles to dissipate the heat generated by the device and reduce its operating temperature. It works by absorbing the heat energy generated by the device and transferring it to the surrounding air via convection. This allows for a significant reduction in operating temperature while providing the most reliable operation available.
The ATS-01B-36-C3-R0 is also designed to improve efficiency and reduce power consumption. It is constructed using efficient heat dissipating materials, which allow for a faster thermal transfer and improved thermal conduction. Additionally, high-performance low-temperature-controlled fans are integrated into the system, which helps reduce power consumption and ensure that the device is protected from extreme temperature changes even when it is in operation.
Overall, the ATS-01B-36-C3-R0 is an excellent option for temperature control in a wide range of applications. It can easily meet the needs of any system or application and is designed to provide an optimal performance level and maximum efficiency. The integrated thermal pad and extended center-to-center spacing help to ensure that the device is protected from extreme temperatures, and the advanced thermal conduction principles ensure that the heat is quickly dissipated. Finally, the efficient heat dissipating materials and low-temperature controlled fans help to reduce power consumption and ensure that the device is adequately cooled even when it is in use.
The specific data is subject to PDF, and the above content is for reference