ATS-01B-43-C1-R0 Fans, Thermal Management |
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Allicdata Part #: | ATS-01B-43-C1-R0-ND |
Manufacturer Part#: |
ATS-01B-43-C1-R0 |
Price: | $ 3.13 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 25X25X10MM L-TAB |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ATS-01B-43-C1-R0 Datasheet/PDF |
Quantity: | 1000 |
10 +: | $ 2.81736 |
30 +: | $ 2.74134 |
50 +: | $ 2.58905 |
100 +: | $ 2.43671 |
250 +: | $ 2.28446 |
500 +: | $ 2.20830 |
1000 +: | $ 1.97985 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 0.984" (25.00mm) |
Width: | 0.984" (25.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.394" (10.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 28.78°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
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The ATS-01B-43-C1-R0 Thermal Heat Sink is a specialized device that is used to control the flow of heat from a source to a target, generally from a high-temperature environment to a lower-temperature one. It works by absorbing and radiating energy, such as heat, from the source to the target to reduce the overall temperature. The Heat Sink is constructed from a variety of materials with high thermal conductivity, such as copper and aluminum, and can be designed to fit a wide range of applications.
The ATS-01B-43-C1-R0 Thermal Heat Sink is designed to dissipate large amounts of heat from a device, while maintaining a relatively lower temperature in the surrounding environment. It can be applied in many different applications that require cooling, such as computers, servers, and other electronic devices. The Heat Sink features a number of fins that are arranged in a way to increase its surface area. This increases the ability of the Heat Sink to absorb and dissipate heat, thus increasing its overall effectiveness.
The ATS-01B-43-C1-R0 Thermal Heat Sink is designed with two components—the lower plate and the upper plate. The lower plate provides a secure and stable base for the Heat Sink, while the upper plate is made of a high-grade heat conductive material. The two plates are attached with an insulating material that is designed to prevent any heat transfer from one plate to the other. This ensures that the Heat Sink does not expand or contract due to excessive temperatures, helping it to maintain an optimal level of thermal performance.
In general, the ATS-01B-43-C1-R0 Thermal Heat Sink can be used in a number of different ways, depending on the application. It can be used to cool a wide variety of electronic devices that require heat to perform their functions. In addition, the Heat Sink can be used in other applications, such as providing cooling for motors and internal circuitry, where additional cooling is necessary.
The ATS-01B-43-C1-R0 Thermal Heat Sink is designed to be easy to install and maintain. To install it, the Heat Sink should be secured to the device or the surface the device is mounted on. Additionally, it is important that the Heat Sink is firmly connected and that the fans, if any, are properly connected. The Heat Sink should also be inspected regularly for early signs of degradation or damage, such as corrosion or cracks.
Overall, the ATS-01B-43-C1-R0 Thermal Heat Sink is a useful device that is designed to dissipate large amounts of heat from electronic devices. It works by increasing the surface area of the device to increase heat dissipation, and can be used in a variety of applications. Additionally, it is easy to install and maintain, making it a reliable choice for many applications.
The specific data is subject to PDF, and the above content is for reference