ATS-01B-60-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-01B-60-C1-R0-ND

Manufacturer Part#:

ATS-01B-60-C1-R0

Price: $ 3.94
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 35X35X35MM L-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-01B-60-C1-R0 datasheetATS-01B-60-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.58596
30 +: $ 3.38646
50 +: $ 3.18730
100 +: $ 2.98809
250 +: $ 2.78888
500 +: $ 2.58968
1000 +: $ 2.53987
Stock 1000Can Ship Immediately
$ 3.94
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.378" (35.00mm)
Width: 1.378" (35.00mm)
Diameter: --
Height Off Base (Height of Fin): 1.378" (35.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 6.33°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinks are commonly used as part of cooling solutions in thermal engineering, especially in electronics and thermodynamics systems. The purpose of a heat sink is to absorb heat away from a hot cluster of electronic components or mechanical parts and dissipate this heat into surrounding air or other liquid substance. ATS-01B-60-C1-R0 is an advanced thermal device with exceptional performance, which can be used in many business or home applications.

ATS-01B-60-C1-R0 Heat Sink is a highly efficient heat conducting device, consisting of three main components - a base, a conduction plate and a fin structure. The base is designed to have exceptional thermal efficiency, with its entire surface embedded in a highly thermally conductive material. The conduction plate acts as the heat transfer medium between the base and the fin structure, and its contact area increases the thermal conductivity of the overall system. Furthermore, the fin structure of the ATS-01B-60-C1-R0 provides a large area to help dissipate the heat away from the source and into the surrounding air.

To operate ATS-01B-60-C1-R0 Heat Sink effectively, one needs to place it in a well-ventilated environment and ensure adequate air flow to dissipate the heat. The device is usually attached directly to a tech device, such as a computer processor, through bolts and a thermal paste spread across the contact area. To maintain cleanliness and maximum performance, the device should also be wiped with a soft cloth regularly to remove the build-up of dust, dirt, and grime.

ATS-01B-60-C1-R0 Heat Sink is an excellent choice for many applications, including personal computers, servers, appliances, electrical and electronic equipment, and even industrial machinery. With an increased contact surface area, it is a reliable and energy-efficient way to keep system\'s temperatures in check. ATS-01B-60-C1-R0 Heat Sink is also highly durable and can withstand a wide temperature range.

In conclusion, the ATS-01B-60-C1-R0 Heat Sink is an excellent choice of thermal device for maximum performance and efficiency in a variety of applications. It features a highly efficient internal design that helps minimize power consumption, while providing exceptional heat dissipation as well. Easy to install and maintain, this device is a great option for those looking to improve the thermal performance of their tech devices.

The specific data is subject to PDF, and the above content is for reference

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