ATS-01B-60-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.378" (35.00mm)
Width:	1.378" (35.00mm)
Diameter:	--
Height Off Base (Height of Fin):	1.378" (35.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	6.36°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal - Heat Sinks: ATS-01B-60-C2-R0 Application Field and Working Principle

Heat sinks are devices used to dissipate heat from a component, usually either an electronic component or a device containing multiple electronic components. This article will focus on the ATS-01B-60-C2-R0 thermal heat sink, its application field and working principle.The ATS-01B-60-C2-R0 heat sink is a high-performance active thermal solution for extended temperatures. It allows users to keep component temperatures lower than the maximum rated operating temperatures, leading to superior performance and longer lifespans. The ATS-01B-60-C2-R0 is designed to provide superior thermal conductivity with its high-density aluminum alloy fins and low resistance thermal interface materials.The ATS-01B-60-C2-R0 thermal heat sink is suitable for use in many industries, including consumer electronics, automotive, medical, industrial automation, and power supplies. This device can be used in applications where the temperature of a component needs to be lowered or maintained to ensure optimal performance, such as in a laptop or other portable device. It can also be used to cool multiple components where a single thermal solution wouldn’t be enough.The ATS-01B-60-C2-R0 heat sink works on the principle of convection. It heats up the air around the device, creating convection currents which lead to greater heat transfer from the device into the surrounding air. This heat transfer is enhanced by the ATS-01B-60-C2-R0’s high-density aluminum alloy fins that provide greater surface area for heat to dissipate. The device also has a special thermal interface material that helps optimise the heat transfer.The ATS-01B-60-C2-R0 thermal heat sink has a number of advantages for users. For one, its low resistance thermal interface materials reduce the amount of heat lost to the ambient air, while its high thermal conductivity allows for greater heat transfer. It also has an optimised fin structure which maximises the dissipated heat. Furthermore, its size and weight make it ideal for use in applications where size and weight are a factor.The ATS-01B-60-C2-R0 thermal heat sink can also be used in applications where air flow is a factor, such as in automotive applications. It has a designed air flow channel through the fins which increases the air flow and enhances the cooling capacity. The thermal conductivity of the device remains consistent regardless of the air flow, making it an ideal heat sink.In conclusion, the ATS-01B-60-C2-R0 thermal heat sink is an effective and reliable thermal solution. It is suitable for use in a variety of applications, from consumer electronics to automotive applications, and offers excellent thermal conductivity and optimal air flow. Its special design and materials make it ideal for maintaining optimal component temperatures and ensuring a long lifespan.

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