| Allicdata Part #: | ATS-01B-60-C3-R0-ND |
| Manufacturer Part#: |
ATS-01B-60-C3-R0 |
| Price: | $ 4.40 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X35MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01B-60-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.95577 |
| 30 +: | $ 3.73611 |
| 50 +: | $ 3.51628 |
| 100 +: | $ 3.29654 |
| 250 +: | $ 3.07677 |
| 500 +: | $ 2.85700 |
| 1000 +: | $ 2.80206 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.50°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-01B-60-C3-R0 is an advanced thermal management device used in many types of consumer electronics. It is designed to provide air-to-surface and air-to-air cooling, as well as to dissipate and remove heat from sensitive components. Its high performance and reliability make it an ideal choice for applications involving high temperatures and heat loads.
As a thermal-heat sink, the ATS-01B-60-C3-R0 can be used in a variety of application fields. It can be used in consumer electronics, such as smartphones, tablets, laptops, and even servers. It can also be used for cooling electronics in medical and industrial applications. The device is also capable of dissipating large amounts of heat, making it suitable for gaming consoles and other high-performance computer systems.
The ATS-01B-60-C3-R0 works by circulating ambient air through its mesh structure at a rate of 60 cubic centimeters per minute. This helps to dissipate the heat from the active electronic components, which lowers their internal temperature. The air passing over the device also helps to reduce the surface temperature of the device, which helps to prevent the device from overheating and damaging itself. The device is also able to absorb and dissipate heat energy from the environment, helping to keep the internal components cool and running at optimal levels.
The high performance of the ATS-01B-60-C3-R0 makes it a popular choice for applications that require a reliable and efficient thermal management solution. Its ability to cool large areas quickly and effectively makes it the ideal choice for large-scale installations. The device also has a long service life and is designed to withstand harsh environmental conditions, making it a reliable choice for mission critical applications.
The ATS-01B-60-C3-R0 is a highly efficient and reliable thermal-heat sink solution that offers superior cooling performance and reliability. Its ability to cool large areas quickly and effectively and its impressive durability make it the ideal choice for a variety of application fields. Whether it is being used for consumer electronics or high-performance computer systems, the ATS-01B-60-C3-R0 can provide the cooling performance and reliability that is required.
The specific data is subject to PDF, and the above content is for reference