| Allicdata Part #: | ATS3004-ND |
| Manufacturer Part#: |
ATS-01B-67-C2-R0 |
| Price: | $ 4.33 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01B-67-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.93750 |
| 10 +: | $ 3.82851 |
| 25 +: | $ 3.61595 |
| 50 +: | $ 3.40326 |
| 100 +: | $ 3.19051 |
| 250 +: | $ 2.97781 |
| 500 +: | $ 2.76511 |
| 1000 +: | $ 2.71193 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 20.30°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are components which are designed to dissipate or reduce the heat generated from an electrical component. Heat sinks are used to reduce component temperature, increase the rate of heat dissipation and prevent damage to components. ATS-01B-67-C2-R0 is a thermal solution which is used to dissipate heat from electrical components.
ATS-01B-67-C2-R0 is designed to prevent the thermal cycling and thermal runaway of components and protect them from over-heating. It is an efficient heat sink designed to provide better heat dissipation while still providing better air flow across the component. It features a robust design which is lightweight and easy to install, making it an ideal solution for commercial, industrial and military applications.
The ATS-01B-67-C2-R0 is made up of an aluminum base and a heat sink section. The aluminum base is designed to provide a perfect thermal path for the heat generated from the component. The heat sink section is designed to dissipate heat more effectively. It is designed to ensure that there is a sufficient amount of airflow across the surface of the heat sink, thus improving the cooling performance of the component.
The ATS-01B-67-C2-R0 is designed to provide superior thermal performance in a wide range of applications. It is suitable for applications such as power supply components, communication systems, and storage systems. Its thermal performance has been tested in a range of environments, ensuring that it can effectively dissipate heat under high temperatures or adverse environmental conditions. Additionally, its lightweight design makes it easy to mount onto any device.
The ATS-01B-67-C2-R0 is designed to maximize cooling performance and efficiency. The heat sink is designed with a combination of thermal fins, heat spreaders and active fan speed control to ensure efficient cooling performance. The heat spreaders are designed to evenly distribute heat over a wide area, thus maximizing the cooling performance. The active fan speed control ensures that the fan is running at the optimal speed, thus reducing the formation of hotspots on the heat sink.
The ATS-01B-67-C2-R0 is an effective thermal solution for a variety of applications. It is designed with robust construction to ensure maximum reliability under extreme conditions, making it an ideal solution for harsh environments. It is designed with a combination of thermal fins and heat spreaders to provide superior cooling performance and efficiency. The lightweight design ensures that it is easy to mount on any device. It is an ideal choice for reducing component temperature, increasing the rate of heat dissipation and preventing damage to components.
The specific data is subject to PDF, and the above content is for reference