| Allicdata Part #: | ATS3011-ND |
| Manufacturer Part#: |
ATS-01B-74-C2-R0 |
| Price: | $ 3.52 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X15MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01B-74-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.20040 |
| 10 +: | $ 3.11472 |
| 25 +: | $ 3.03055 |
| 50 +: | $ 2.86209 |
| 100 +: | $ 2.69375 |
| 250 +: | $ 2.52542 |
| 500 +: | $ 2.44124 |
| 1000 +: | $ 2.18870 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 20.35°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management plays an critical role in modern electronics and is widely used across various industrial and commercial applications. Properly managing temperatures in a electronic device is vital to performance, longevity, and safety. The ATS-01B-74-C2-R0 heat sink is a critical component of many thermal management systems, and understanding its capabilities and limitations is crucial to successful thermal management.
In its simplest form, ATS-01B-74-C2-R0 is a heat dissipator, providing a conduction path for heat generated in electronic components to be removed from the system. It is mostly made of aluminum and other heat-conductive materials that are designed to absorb and dissipate heat quickly. It is usually mounted to a large heat-generating component on a circuit board with a thermal interface material, such as thermal grease, to maximize heat transfer.
This specific heat sink has a relatively large surface area and low profile, making it ideal for densely-packaged applications such as servers, industrial controllers, mobile phones, and embedded computers. Since it is also lightweight, it can be easily moved and installed in a wide variety of places. This makes it beneficial for applications that frequently undergo changes, such as medical equipment or laboratory experiments.
The heat sink also has excellent thermal properties, able to withstand temperatures up to 390°F and dissipate up to 2.3 W of power with a thermal resistance as low as 0.14°C/W. This allows for greater heat dissipation than many other models and makes it suitable for a wide variety of applications. In addition, the heat sink is also capable of dissipating heat at a rate that is twice as fast as some similar models at the same temperature.
The primary working principle of ATS-01B-74-C2-R0 is simple. Heat is transferred from the device into the heat sink through electrical or convection properties, depending on the type of heat sink. Once the heat is transferred, it is dissipated into the surrounding environment. Depending on the enclosure design, the heat sink can also be used to remove heat from the surrounding environment, enabling it to act as a heat sink and a cooling fan.
The ATS-01B-74-C2-R0 is one of the most popular and versatile heat sinks available. It is perfect for a variety of applications, including consumer electronics, industrial computers, medical equipment, military devices, and many more. Due to its superior thermal properties, excellent performance, low cost, and reliability, it is the go-to solution for thermal management.
The specific data is subject to PDF, and the above content is for reference