| Allicdata Part #: | ATS-01C-10-C3-R0-ND |
| Manufacturer Part#: |
ATS-01C-10-C3-R0 |
| Price: | $ 3.93 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01C-10-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.57399 |
| 30 +: | $ 3.37554 |
| 50 +: | $ 3.17696 |
| 100 +: | $ 2.97845 |
| 250 +: | $ 2.77989 |
| 500 +: | $ 2.58133 |
| 1000 +: | $ 2.53168 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.99°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks have been in use for application and cooling of components for many years. The ATS-01C-10-C3-R0 heat sink is an excellent example of a specialized heat sink designed to match the heat output of a specific processor. Its superior design allows for the efficient cooling of high-power devices while providing low noise levels.
The ATS-01C-10-C3-R0 utilizes an optimized heat transfer design that features a heat dissipating copper core that is surrounded by an aluminum shell. This shell is then enclosed in a plastic outer casing to further reduce the noise generated. The copper core works to quickly absorb and dissipate heat, while the aluminum frame allows for increased surface area and improved heat dispersion. The plastic outer layer acts as an insulator, reducing the noise to a minimum.
The ATS-01C-10-C3-R0\'s design provides a high thermal performance at an affordable price. The heat sink is designed with a pre-drilled mounting holes for easy installation and utilizes a fanless and noiseless design. The device also incorporates thermal pads for improved heat transfer and wider compatibility when mounting components. Additionally, its optimized design allows the product to provide a higher thermal performance without the need for additional components.
The ATS-01C-10-C3-R0 can be used in a variety of applications within the electronics industry. This heat sink is best suited for cooling high-power devices such as processors, FPGAs, GPUs, and memory modules. Its design also lends itself well to cooling other components such as voltage regulators, capacitors, and resistors. Additionally, this heat sink is often used in the cooling of laser and ultra-violet light sources.
The ATS-01C-10-C3-R0 operates in a dual-thermal mode, allowing it to be used for both air cooling and liquid cooling. During air cooling, the device draws air intake from the surrounding environment and passes it through the copper core. The core heats the air which is then released into the environment. During liquid cooling, the device draws coolant from a reservoir and pumps it through the heat sink. The coolant absorbs the heat and is then circulated back to the reservoir.
The ATS-01C-10-C3-R0 brings improved noise levels and enhanced heat transfer capabilities at an affordable cost, making it an ideal choice for the thermal cooling of high-power devices. Its advanced design makes the device suitable for both air and liquid cooling, allowing the user to choose the most efficient cooling solution for their application.
The specific data is subject to PDF, and the above content is for reference