ATS-01C-117-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	10.46°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

Thermal - Heat Sinks are integral components in many electronic systems. They dissipate the heat generated by internal components, such as processors, hard drives, and other components. ATS-01C-117-C1-R0 is a specially designed heat sink from technologies that can effectively dissipate heat and maintain cooler temperatures within an enclosure. Here we will discuss the application field and working principle of ATS-01C-117-C1-R0.

Application Field

ATS-01C-117-C1-R0 is a high performance heat sink that can be used in a variety of applications. It is designed for use in high temperature and/or high powered electronics systems, such as CPUs, GPUs, power amplifiers, and power supplies. Its high performance aluminum body and fin structure have been proven to effectively dissipate heat from these types of applications. It is also suitable for use in other systems that require effective thermal management, such as personal computers, game consoles, network equipment, and 3D printers.

Working Principles

The ATS-01C-117-C1-R0 has been designed to effectively dissipate heat through convection. The design consists of an aluminum body that is machined to have evenly spaced fin-like structures. These structures act as channels which allow hot air generated by the system components to escape, effectively convecting the heat away from the components. The aluminum body of the heat sink also acts as a large heat sink, which absorbs and conducts heat away from the other components, further enhancing its cooling capabilities.The heat sink also includes a heat spreader which has been specifically designed to conform to the heat dissipation requirements of modern electronics. The heat spreader itself is made up of a combination of aluminum and other thermal materials, such as copper or diamond particles. This combination helps to spread heat over a larger area which allows for further cooling and improved thermal management.

Heat Sink Maintenance

Regular maintenance of the heat sink is necessary if it is to continue to provide effective cooling. It is important to regularly clean the aluminum body and the heat spreader, as well as ensuring that the fins are free of dust and debris. This will help to ensure that the heat transfer between the components and the heat sink is as efficient as possible.It is also important to ensure that the heat spreader is not blocking air intake or exhaust openings, as this can reduce the effectiveness of the heat sink and put additional strain on internal components. Also, make sure to adjust the fan speed or size of the heat sink as necessary to keep temperatures within the safe range.

Conclusion

ATS-01C-117-C1-R0 heat sink is an effective and reliable component for dissipating heat in various electronics systems. It is suitable for use in high temperature applications, such as CPUs, GPUs, and power supplies, as well as for other systems requiring effective thermal management. The design consists of an aluminum body and fin structures that channel the hot air generated by the system components, as well as a heat spreader made from aluminum and other thermal materials that spread the heat over a larger area for improved cooling. Regular maintenance of the heat sink is necessary to maximize its cooling effectiveness, such as cleaning the components and the fins. With proper care, the ATS-01C-117-C1-R0 heat sink can provide reliable and effective cooling for many years.

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