| Allicdata Part #: | ATS3081-ND |
| Manufacturer Part#: |
ATS-01C-131-C2-R0 |
| Price: | $ 5.56 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X20MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01C-131-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 5.05260 |
| 10 +: | $ 4.91589 |
| 25 +: | $ 4.64285 |
| 50 +: | $ 4.36968 |
| 100 +: | $ 4.09658 |
| 250 +: | $ 3.82347 |
| 500 +: | $ 3.55036 |
| 1000 +: | $ 3.48209 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.60°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
。Thermal management is an important design consideration in the modern age, particularly with regards to mechanical and electronic devices. Heat sinks are one of the most commonly used components in thermal management to dissipate heat. ATS-01C-131-C2-R0 is a type of heat sink developed specifically for applications where reliable and low-dissipation performance is required.
ATS-01C-131-C2-R0 heat sink is designed to balance efficient cooling and high power density. It is composed of a highly conductive aluminum base and a nylon polymer top and bottom envelope. With such construction, ATS-01C-131-C2-R0 heat sink can facilitate temperatures as high as 150°C, while keeping power densities up to 16 watts per cubic centimeter. The heat sink is designed for applications where fan-based cooling is not necessary. This alleviates issues such as noise, dust, and electro-magnetic interference.
Because of its light weight and slim profile, the ATS-01C-131-C2-R0 heat sink is well-suited for applications where space is constrained. The heat sink is capable of dissipating heat via air-convection, so the need for a fan is not mandatory. Despite its relatively low weight, ATS-01C-131-C2-R0 is rated to handle up to 17 W/cc of heat.
The ATS-01C-131-C2-R0 heat sink works on the principle of conduction. Heat is transferred from the heat source, usually a processor, to the heat-dissipating surface of the heat sink by conductive bonds. At the same time, air-convection is responsible for dissipating the heat away from the surface of the heat sink. This process is highly efficient and keeps temperatures safely within required margins.
ATS-01C-131-C2-R0 is a popular choice among thermal designers, as it provides the flexibility of low power dissipation, light weight, and small size while maintaining adequate thermal performance. Its applications range from automotive electronics to communication and control systems. Due to its high reliability and energy-efficiency, it has become an ideal choice for many microprocessor applications.
In summary, the ATS-01C-131-C2-R0 heat sink is a reliable and low-dissipation option for thermal management applications. It is composed of a highly conductive aluminum base and a nylon polymer top and bottom envelope. The heat sink works on the principle of heat conduction to transfer the heat from the source to the heat-dissipating surface, and air-convection to dissipate the heat away. It is suitable for applications where fan-based cooling is not necessary and is capable of dissipating up to 17 W/cc. With its lightweight and slim profile, it is often the preferred choice for applications where space is at a premium.
The specific data is subject to PDF, and the above content is for reference