| Allicdata Part #: | ATS-01C-139-C3-R0-ND |
| Manufacturer Part#: |
ATS-01C-139-C3-R0 |
| Price: | $ 3.33 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X20MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01C-139-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.03156 |
| 30 +: | $ 2.94945 |
| 50 +: | $ 2.78573 |
| 100 +: | $ 2.62181 |
| 250 +: | $ 2.45796 |
| 500 +: | $ 2.37602 |
| 1000 +: | $ 2.13022 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.37°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are important components in a wide variety of applications, and the ATS-01C-139-C3-R0 is an excellent choice for these applications. It is designed for use in embedded systems, providing a thermal solution in a compact form factor. In this article, we\'ll take a look at the application field and working principle of the ATS-01C-139-C3-R0.
The ATS-01C-139-C3-R0 is designed for use in embedded systems. It features a small footprint and low profile design, making it ideal for use in space-constrained applications. The ATS-01C-139-C3-R0 is a high-performance thermal solution, with a thermal resistance that is 10 times better than traditional heatsinks. It also features efficient air cooling technology, which makes it suitable for applications where air flow is limited.
The ATS-01C-139-C3-R0 is designed to work with various electronic components, such as CPUs, GPUs, and FPGAs. It features an optimized pin structure, which allows for efficient thermal transfer from the heat source to the heatsink. This ensures that the heatsink is able to dissipate the heat quickly and effectively. The ATS-01C-139-C3-R0 also has an effective thermal interface, which provides superior thermal conductivity and ensures minimal power loss.
In order to maximize the performance of the ATS-01C-139-C3-R0, it is important to ensure that the heatsink is properly installed. This can be done by mounting the heatsink on the electronics board, using the included mounting pins and screws. Once the heatsink is mounted, a thermal compound should be applied to the surface of the heatsink. This will help to create a better thermal bond between the heatsink and the electronic components.
The ATS-01C-139-C3-R0 is an ideal choice for applications where component temperature control is critical. Its high thermal conductivity and efficient air cooling technology helps to keep the temperatures of the components within a safe range. This ensures stable system performance and longer component life. Additionally, the ATS-01C-139-C3-R0 is RoHS compliant, which means it is safe for use in most electronic products.
In conclusion, the ATS-01C-139-C3-R0 is a versatile thermal solution that can be used in a wide variety of applications. It features a compact form factor and high thermal performance, making it ideal for space-constrained embedded systems. It is also RoHS compliant, which makes it safe for use in most electronic products. With its optimized pin structure and superior thermal conductivity, the ATS-01C-139-C3-R0 is an excellent choice for thermal management in embedded systems.
The specific data is subject to PDF, and the above content is for reference