| Allicdata Part #: | ATS-01C-140-C3-R0-ND |
| Manufacturer Part#: |
ATS-01C-140-C3-R0 |
| Price: | $ 3.39 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X25MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01C-140-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.07881 |
| 30 +: | $ 2.99586 |
| 50 +: | $ 2.82933 |
| 100 +: | $ 2.66295 |
| 250 +: | $ 2.49652 |
| 500 +: | $ 2.41329 |
| 1000 +: | $ 2.16364 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.55°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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：Thermal-Heat Sinks are important components for electronic devices, as they help dissipate heat generated from the device\'s components. The ATS-01C-140-C3-R0 is a highly efficient thermal-heat sink device which helps in the dissipation of excess heat generated from electronic components in various applications.
The ATS-01C-140-C3-R0 is a flat plate-fin heat sink with an Aluminum alloy construction. It has a low profile design, and is an ideal choice for applications that require a small form factor. The fins of the heat sink are designed to maximize surface area, and offer high heat transfer efficiency. The base has mounting holes for easy installation and the fin\'s pitch can be adjusted for maximum cooling efficiency.
The ATS-01C-140-C3-R0 is suitable for a wide range of electronic components, including CPUs, GPUs, ASICs, FPGAs and voltage regulators. It is especially suitable for high-power density systems, where heat dissipation is a key factor. The heat sink features a relatively low air pressure drop, as well as a lower acoustic noise level than other similar models.
The working principle of the ATS-01C-140-C3-R0 is simple yet effective. Heat generated by electronic components is conducted away from the components by the aluminum base and fins. The fins then help to dissipate the heat away from the device and into the surrounding air. The air is kept in motion by the fan mounted atop the heat sink, which further increases the rate of heat dissipation. This simple yet effective process helps the device to efficiently remove heat generated by electronic components without relying on external cooling sources.
The ATS-01C-140-C3-R0 is a versatile thermal-heat sink device which is ideal for a variety of application fields and is widely used in electronics. Its low profile design, adjustable fin pitch, and high heat transfer efficiency make it perfect for small form factor applications, while its low air pressure drop and low acoustic noise level make it suitable for larger applications. This makes it an ideal choice for electronics engineers looking for an effective and efficient way to cool their devices.
The specific data is subject to PDF, and the above content is for reference