| Allicdata Part #: | ATS3118-ND |
| Manufacturer Part#: |
ATS-01C-165-C2-R0 |
| Price: | $ 3.32 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X10MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01C-165-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.01770 |
| 10 +: | $ 2.93643 |
| 25 +: | $ 2.85692 |
| 50 +: | $ 2.69829 |
| 100 +: | $ 2.53953 |
| 250 +: | $ 2.38085 |
| 500 +: | $ 2.30148 |
| 1000 +: | $ 2.06339 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.36°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
A heat sink is a mechanical device designed to disperse or dissipate heat generated by an electronic component. Heat sinks are used with integrated circuits, which are commonly found in computers and other electronic devices operating at a high speed, as well as automotive and aerospace applications. The ATS-01C-165-C2-R0 is a heat sink designed to provide efficient cooling for large power devices. It is typically used in applications such as power semiconductor, communicatios, industrial automation, and medical applications.
Application Field of ATS-01C-165-C2-R0
The ATS-01C-165-C2-R0 is designed to effectively dissipate heat from large power devices such as power semiconductors, RF transmitters, and power adapters. It can be used for applications such as automotive, aerospace, and medical devices, as well as industrial automation applications. The heat sink is also suitable for use in communication networks and computing applications, where cooling is essential to prevent system stability.
Working Principle of ATS-01C-165-C2-R0
The ATS-01C-165-C2-R0 is a heat sink that uses an efficient aluminum extrusion process to dissipate heat. It is designed with an integrated heat sink base and a large aluminum extrusion fin surface, which allows for efficient air flow across the device. The extrusion fins are designed to optimize the thermal performance of the heat sink, allowing for greater cooling of the device.
The ATS-01C-165-C2-R0 also features a base that is anodized or plated for enhanced corrosion resistance. This not only increases the longevity of the heat sink, but also makes it suitable for applications such as automotive electronics, aerospace, and medical applications, which require a higher level of corrosion resistance.
In addition to the anodized or plated base, the ATS-01C-165-C2-R0 is designed with four mounting points that allow for a more secure installation and a better fit. The thermal conductivity of the aluminum extrusion fin surface ensures efficient cooling while the four mounting points offer a secure and reliable connection between the heat sink and the device.
Conclusion
The ATS-01C-165-C2-R0 heat sink is an ideal choice for applications such as power semiconductor, communication, industrial automation and medical applications. It provides an efficient aluminum extrusion process with an integrated heat sink base and large aluminum extrusion fin surface for superior cooling. The base is anodized or plated for enhanced corrosion resistance and the four mounting points provide a secure installation. With its efficient and reliable cooling, the ATS-01C-165-C2-R0 is a great choice for a wide range of applications.
The specific data is subject to PDF, and the above content is for reference