| Allicdata Part #: | ATS-01C-168-C1-R0-ND |
| Manufacturer Part#: |
ATS-01C-168-C1-R0 |
| Price: | $ 3.17 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X25MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01C-168-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.87721 |
| 30 +: | $ 2.79909 |
| 50 +: | $ 2.64361 |
| 100 +: | $ 2.48812 |
| 250 +: | $ 2.33264 |
| 500 +: | $ 2.25488 |
| 1000 +: | $ 2.02162 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.94°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-01C-168-C1-R0 is a thermal conductor used to transfer heat from a heat source to a heat sink, such as in the cooling of electronics. It is a versatile product that is widely used in a variety of industries, such as automotive, aerospace, military and medical.
The heat sink is the component of the ATS-01C-168-C1-R0 that absorbs the heat generated by the heat source. The heat sink is typically made of a metal material that conducts heat easily, such as aluminum or copper. A fan is also typically mounted to the heat sink to provide additional cooling.
The heat source of the ATS-01C-168-C1-R0 is typically an electronic device, such as a processor, a graphics card, or a hard drive. The heat source is usually in direct contact with the heat sink, and the heat generated by the heat source is transferred to the heat sink via the thermal conductor. The thermal conductivity of the ATS-01C-168-C1-R0 is dependent on the thickness and composition of the thermal conductor.
The ATS-01C-168-C1-R0 is widely used in situations where a heat source must be cooled quickly and effectively. This includes computers, automotive electronics, and aerospace systems. Due to its efficient cooling capabilities, the ATS-01C-168-C1-R0 is particularly suitable for applications that require rapid thermal cycling.
The ATS-01C-168-C1-R0 is a reliable and versatile thermal conductor. This product is designed to provide efficient heat transfer between two components, and it is ideal for cooling high-powered devices. By using a fan in conjunction with the heat sink, the thermal efficiency of the ATS-01C-168-C1-R0 is further increased, resulting in improved overall performance. As such, this thermal conductor is a popular choice for applications that involve high temperatures and need to be cooled quickly and efficiently.
The ATS-01C-168-C1-R0 is a great thermal-heat sink for cooling a wide range of electronics. It provides efficient thermal transfer from the heat source to the heat sink, and it is designed to withstand the varying temperatures generated by the heat source. Additionally, because of its efficient cooling capabilities, the ATS-01C-168-C1-R0 is a great choice for applications that require rapid thermal cycling. Overall, the ATS-01C-168-C1-R0 is a reliable and versatile product which can be used in a variety of applications to provide efficient thermal transfer between heat sources and sinks.
The specific data is subject to PDF, and the above content is for reference