| Allicdata Part #: | ATS3122-ND |
| Manufacturer Part#: |
ATS-01C-169-C2-R0 |
| Price: | $ 3.76 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X10MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01C-169-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.42090 |
| 10 +: | $ 3.32892 |
| 25 +: | $ 3.23870 |
| 50 +: | $ 3.05878 |
| 100 +: | $ 2.87885 |
| 250 +: | $ 2.69892 |
| 500 +: | $ 2.60896 |
| 1000 +: | $ 2.33906 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.71°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
Temperature control and heat dissipation are among the most common challenges faced in a variety of industries, from electronics to industrial and aerospace applications. ATS-01C-169-C2-R0 is a thermal solution developed to address these challenges. It is designed to provide superior performance in both industry grade emissions levels and operating temperatures.
ATS-01C-169-C2-R0 Application Field
ATS-01C-169-C2-R0 is ideal for applications requiring superior conductive cooling or temperature management. Applications using ATS-01C-169-C2-R0 include:
- Electronics, including computer components
- Industrial automation
- Medical equipment
- Industrial and aerospace applications
ATS-01C-169-C2-R0 can also be used in combination with a variety of materials, from plastic to metal, to create effective thermal management solutions for a wide range of needs.
ATS-01C-169-C2-R0 Working Principle
The working principle of the ATS-01C-169-C2-R0 is based on the internationally-recognized theory of thermal management. It operates on the principle of a heat sink, which is a device designed to absorb and dissipate heat away from sensitive components and systems. By utilizing this technique, the ATS-01C-169-C2-R0 is able to effectively manage the temperature of its surroundings, providing a reliable cooling solution.
ATS-01C-169-C2-R0 is constructed of an extruded copper base utilizing a patented copper plating technique to ensure maximum durability. The upper portions of the device are constructed of a die-cast aluminum alloy, with a high- opacity black, matte finish. This combination of materials offers superior heat absorption and dissipation capabilities, while remaining lightweight and highly effective.
ATS-01C-169-C2-R0 Benefits
The ATS-01C-169-C2-R0 has several benefits that make it a valuable solution for temperature and cooling needs. These include:
- Superior performance in both industry grade emissions levels and operating temperatures
- Highly effective and efficient with superior heat absorption and dissipation capabilities
- Lightweight and durable construction
- Highly customizable for a variety of applications
- Low maintenance and easy to install
The ATS-01C-169-C2-R0 is currently available in a range of sizes and models to accommodate various applications. Additionally, custom configurations can be created to meet specific requirements.
Conclusion
The ATS-01C-169-C2-R0 provides temperature control and heat dissipation solutions for a variety of industries, from electronics to industrial and aerospace applications. It is designed with superior performance in both industry grade emissions levels and operating temperatures, and is lightweight and highly effective. The ATS-01C-169-C2-R0 is highly customizable with a range of sizes and models available, and can be configured to meet specific needs. This makes it a valuable solution for temperature control and heat dissipation.
The specific data is subject to PDF, and the above content is for reference