ATS-01C-176-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS3130-ND

Manufacturer Part#:

ATS-01C-176-C2-R0

Price: $ 4.03
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 35X35X15MM R-TAB T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-01C-176-C2-R0 datasheetATS-01C-176-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 3.66030
10 +: $ 3.56265
25 +: $ 3.36470
50 +: $ 3.16676
100 +: $ 2.96881
250 +: $ 2.77089
500 +: $ 2.57297
1000 +: $ 2.52349
Stock 1000Can Ship Immediately
$ 4.03
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.378" (35.00mm)
Width: 1.378" (35.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.590" (15.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 8.59°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal solutions are essential components for cooling electronic components and systems. Heat sinks are one of the most common forms of thermal solutions, and the ATS-01C-176-C2-R0 heat sink is a reliable and cost-effective option. This heat sink is specifically designed to help maintain optimal temperatures for a variety of electronic applications, including multimedia, medical, telecommunications, industrial, automotive and consumer electronics. In this article, we’ll discuss the application field and working principle of the ATS-01C-176-C2-R0 heat sink in detail.

The ATS-01C-176-C2-R0 heat sink is designed to dissipate heat away from sensitive electronic components or systems, such as processors, FPGAs, and memory modules. This heat sink features an aluminum core that provides excellent thermal conductivity, and a copper heat spreader for improved heat transfer. The aluminum core also helps to reduce the heat build-up. Additionally, the heat sink includes a built-in fan that helps to further dissipate heat without increasing noise levels.

The ATS-01C-176-C2-R0 heat sink is suitable for a wide variety of applications due to its small size and reliable cooling performance. It is ideal for use in high-density or cramped applications, and its size allows for easy installation. The heat sink is also designed to be compatible with a variety of mounting options, which makes installation easy. Additionally, the heat sink is well suited for use in higher temperatures, as its aluminum core and copper heat spreader provide excellent thermal conductivity and dispersion to keep components cool.

The ATS-01C-176-C2-R0 heat sink also features an adjustable fan speed setting. This means that the fan speed can be adjusted for specific applications, allowing the heat sink to be used at optimum cooling levels. Additionally, the fan is designed with high-quality bearings, ensuring smooth operation and a long service life. The fan also features a low-noise level, which makes it suitable for quieter applications.

The working principle of the ATS-01C-176-C2-R0 heat sink is simple. Heat from the component or system is absorbed by the aluminum core and copper heat spreader. The heat is then dissipated into the air by the built-in fan. As the heat is spread across the entire heat sink, the cooling effect is more evenly distributed, allowing for greater cooling efficiency.

The ATS-01C-176-C2-R0 heat sink is a reliable and cost-effective thermal solution for a variety of applications. Its low-noise fan, adjustable fan speed, and excellent thermal conductivity make it suitable for a wide variety of applications. Additionally, its small size, easy installation, and compatibility with a variety of mounting options make it a great choice for cramped or dense applications. With its reliable performance and reasonable price, the ATS-01C-176-C2-R0 heat sink is the ideal solution for cooling electronic components and systems.

The specific data is subject to PDF, and the above content is for reference

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