ATS-01C-18-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.126" (54.01mm)
Width:	2.126" (54.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.590" (15.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	13.45°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal – Heat Sinks: ATS-01C-18-C3-R0 Application Field and Working Principle

Thermal – Heat Sinks have been around since the early days of electronic devices and continue to be widely used in a number of applications. One such Heat Sink is the ATS-01C-18-C3-R0. This device is a type of non-isolated, thermally-managed, electrical sink designed to dissipate heat from electrical components while affording superior cooling performance and reliability.Heat sinks are used when the operating temperature of an electronic component exceeds its designed limits. In an ATS-01C-18-C2-R0 Heat Sink, heat is dissipated to the surrounding environment by convection or thermal transfer via fins. The aluminum fins are designed to increase surface area for maximum heat dissipation, while also allowing for greater cooling volumes.The ATS-01C-18-C3-R0 Heat Sink is comprised of a die-cast aluminum baseplate and fins that are connected to copper heatpipes. The heat pipes transfer the heat from the electronic component to the fins, where it is then dissipated into the air. This design ensures a reliable and efficient cooling process.For the ATS-01C-18-C3-R0 Heat Sink, the copper heatpipes are designed with a grooved cross-section that is optimized to minimize thermal resistance. This ensures that the heat is transferred to the fins quickly and efficiently. Additionally, the heatpipes are filled with a dielectric medium to eliminate electrical interference.The fins of the ATS-01C-18-C3-R0 Heat Sink feature a number of slits that promote increased thermal transfer. This is achieved by the addition of anisotropic materials that create turbulence in the air flow and increase the surface contact area between the fins and the air. This allows for better heat dissipation and increased cooling efficiency.The application field of the ATS-01C-18-C3-R0 Heat Sink includes power conversion and distribution applications. It has a maximum temperature resistance of 150°C and a thermal resistance of 0.25°C/W. Additionally, this device is compliant with RoHS and is UL certified to ensure safe and reliable operation.In conclusion, the ATS-01C-18-C3-R0 Heat Sink is a reliable and efficient device for heat dissipation and thermal management. With its anisotropic fins, dielectric medium-filled heatpipes, and high temperature resistance, this device can be used in a variety of applications. Its UL certification and RoHS compliance guarantee safety and reliability in any environment.

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