ATS-01C-180-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.378" (35.00mm)
Width:	1.378" (35.00mm)
Diameter:	--
Height Off Base (Height of Fin):	1.378" (35.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	3.46°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction to Thermal - Heat Sinks

Thermal - Heat Sinks are an essential component of many electronic devices. They are designed to dissipate heat generated from the components of the device or to move heat from one area to another. They are made from heat dissipation materials such as aluminum, copper and steel, and come in a wide variety of shapes and sizes. The most common shapes are rectangular, cubic, cylindrical, hemisphere and conical.

ATS-01C-180-C3-R0 Application Field and Working Principle

The ATS-01C-180-C3-R0 is a Thermal - Heat Sink specifically designed for the cooling requirements of high-powered industrial electronics. It is a double-sided aluminum convection heat sink that allows for superior heat transfer from the components to the surroundings. The heat sink has two sets of fins extending out from the sides; these fins act as barriers to heat transfer by increasing the surface area available for heat to dissipate. The fins are also placed in a pattern to enhance the heat transfer process.The ATS-01C-180-C3-R0 provides a highly efficient yet low cost solution to the cooling requirements of high-powered industrial electronics. It is especially suitable for use in power amplifiers, CPU cooling, laser cooling, and motor controllers. It can also be used to cool high-powered computer processors. The design ensures a high heat dissipation rate and low thermal resistance between the components and the surrounding area.The working principle of the ATS-01C-180-C3-R0 is based on convection of heat. Convection is the process by which heat is transferred from one point to another through the medium of a fluid. In the case of the ATS-01C-180-C3-R0, the fins act as a medium between the device and its environment. The fins are in a pattern which ensures that the heat generated by the device is effectively transferred to the atmosphere.

Conclusion

The ATS-01C-180-C3-R0 is a Thermal - Heat Sink designed with high-performance cooling efficiency in mind. Its double-sided fins increase the available surface area for heat to dissipate. The working principle of the ATS-01C-180-C3-R0 is convection, which allows for the heat to be efficiently transferred from the components of the device to its environment. The ATS-01C-180-C3-R0 is suitable for a variety of devices and offers an affordable cooling solution for high-powered industrial electronics.

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